SRAM Module, 256KX32, 25ns, CMOS, PQMA68,
Parameter Name | Attribute value |
Maker | White Microelectronics |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
Other features | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE |
JESD-30 code | S-PQMA-J68 |
memory density | 8388608 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX32 |
Package body material | PLASTIC/EPOXY |
Package shape | SQUARE |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal location | QUAD |
WPS256K32-25PJC | WPS256K32-20PJI | WPS256K32-17PJI | WPS256K32-25PJI | WPS256K32B-15PJI | WPS256K32B-15PJC | WPS256K32B-12PJI | WPS256K32-20PJC | WPS256K32B-12PJC | |
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Description | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 20ns, CMOS, PQMA68, | SRAM Module, 256KX32, 17ns, CMOS, PQMA68, | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 15ns, CMOS, PQMA68, | SRAM Module, 256KX32, 15ns, CMOS, PQMA68, | SRAM Module, 256KX32, 12ns, CMOS, PQMA68, | SRAM Module, 256KX32, 20ns, CMOS, PQMA68, | SRAM Module, 256KX32, 12ns, CMOS, PQMA68, |
Maker | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics | White Microelectronics |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
Maximum access time | 25 ns | 20 ns | 17 ns | 25 ns | 15 ns | 15 ns | 12 ns | 20 ns | 12 ns |
Other features | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE |
JESD-30 code | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bi |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | - | - |
organize | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |