SRAM Module, 2MX8, 20ns, CMOS,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | White Microelectronics |
Reach Compliance Code | unknown |
Maximum access time | 20 ns |
Other features | BATTERY BACKUP |
JESD-30 code | R-XDMA-T36 |
JESD-609 code | e0 |
memory density | 16777216 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 36 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX8 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
WPS2M8-20C2C | WPS2M8-25C2C | WPS2M8-35C2C | |
---|---|---|---|
Description | SRAM Module, 2MX8, 20ns, CMOS, | SRAM Module, 2MX8, 25ns, CMOS, | SRAM Module, 2MX8, 35ns, CMOS, |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | unknown | unknown |
Maximum access time | 20 ns | 25 ns | 35 ns |
Other features | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP |
JESD-30 code | R-XDMA-T36 | R-XDMA-T36 | R-XDMA-T36 |
JESD-609 code | e0 | e0 | e0 |
memory density | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 36 | 36 | 36 |
word count | 2097152 words | 2097152 words | 2097152 words |
character code | 2000000 | 2000000 | 2000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 2MX8 | 2MX8 | 2MX8 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | White Microelectronics | - | White Microelectronics |