DDR DRAM, 256MX4, CMOS, PBGA68, ROHS COMPLIANT, FBGA-68
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ProMOS Technologies Inc |
Parts packaging code | BGA |
package instruction | TFBGA, |
Contacts | 68 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | MULTI BANK PAGE BURST |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B68 |
length | 17 mm |
memory density | 1073741824 bit |
Memory IC Type | DDR DRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 68 |
word count | 268435456 words |
character code | 256000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256MX4 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 9 mm |