Flash, 16KX8, DIE
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IC Microsystems Sdn Bhd |
Parts packaging code | DIE |
package instruction | DIE |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 0.4 MHz |
JESD-30 code | R-XUUC-N |
JESD-609 code | e0 |
memory density | 131072 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
word count | 16384 words |
character code | 16000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -20 °C |
organize | 16KX8 |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
Maximum write cycle time (tWC) | 10 ms |