EEWORLDEEWORLDEEWORLD

Part Number

Search

OR3T30-4BA256I

Description
Field Programmable Gate Array, 196 CLBs, 24000 Gates, 1568-Cell, CMOS, PBGA256, PLASTIC, BGA-256
CategoryProgrammable logic devices    Programmable logic   
File Size2MB,210 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
Download Datasheet Parametric View All

OR3T30-4BA256I Overview

Field Programmable Gate Array, 196 CLBs, 24000 Gates, 1568-Cell, CMOS, PBGA256, PLASTIC, BGA-256

OR3T30-4BA256I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLSC/CSI
Parts packaging codeBGA
package instructionBGA, BGA256,20X20,50
Contacts256
Reach Compliance Codeunknown
Combined latency of CLB-Max2.34 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee0
Configurable number of logic blocks196
Equivalent number of gates24000
Number of entries217
Number of logical units1568
Output times217
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize196 CLBS, 24000 GATES
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
Preliminary Data Sheet, Rev. 1
September 1998
ORCA
®
Series 3
Field-Programmable Gate Arrays
Features
T
High-performance, cost-effective, 0.35 µm (OR3C) and
0.3 µm (OR3T) 4-level metal technology, with a migra-
tion plan to 0.25 µm technology (4- or 5-input look-up
table delay of 1.7 ns with -5 speed grade in 0.35 µm).
Up to 186,000 usable gates in 0.3 µm, expanding to
320,000 usable gates in 0.25 µm.
Up to 452 user I/Os. (OR3Txxx I/Os are 5 V tolerant to
allow interconnection to both 3.3 V and 5 V devices,
selectable on a per-pin basis.)
Pin selectable I/O clamping diodes provide 5 V or 3.3 V
PCI compliance and 5 V tolerance on OR3Txxx devices.
New
twin-quad programmable function unit (PFU) archi-
tecture with eight 16-bit look-up tables (LUTs) per PFU,
organized in two nibbles for use in nibble- or byte-wide
functions. Allows for mixed arithmetic and logic functions
in a single PFU.
Nine user registers per PFU, one following each LUT,
plus one extra. All have programmable clock enable and
local set/reset, plus a global set/reset that can be dis-
abled per PFU.
New
flexible input structure (FINS) of the PFUs provides
a routability enhancement for LUTs with shared inputs
and the logic flexibility of LUTs with independent inputs.
Fast-carry logic and routing to adjacent PFUs for
nibble-, byte-wide, or longer arithmetic functions, with
the
new
option to register the PFU carry-out.
New
softwired LUTs (SWL) allow fast cascading of up to
three levels of LUT logic in a single PFU for up to 40%
speed improvement.
New
supplemental logic and interconnect cell (SLIC)
provides 3-statable buffers, up to 10-bit decoder, and
PAL*-like
AND-OR with optional INVERT in each pro-
grammable logic cell (PLC).
T
Abundant hierarchical routing resources based on rout-
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
ing two data nibbles and two control lines per set provide
for faster place and route implementations and less rout-
ing delay.
TTL or CMOS input levels programmable per pin for the
OR3Cxx (5.0 V) devices.
Individually programmable drive capability: 12 mA sink/
6 mA source or 6 mA sink/3 mA source.
Built-in boundary scan (IEEE
1149.1 JTAG) and
3-state all I/O pins (TS_ALL) testability functions.
Enhanced system clock routing for low skew, high-speed
clocks originating on-chip or at any I/O.
Up to four
new
ExpressCLK inputs allow extremely fast
clocking of signals on- and off-chip plus access to inter-
nal general clock routing.
New
StopCLK feature to glitchlessly stop/start Express-
CLK
s
independently by user command.
New
programmable I/O (PIO) has:
— Fast-capture input latch and input flip-flop (FF)
latch for reduced input setup time and zero hold time.
— Capability to (de)multiplex I/O signals.
— Fast access to SLIC for decodes and
PAL-like
functions.
— Output FF and two-signal function generator to
reduce CLK to output propagation delay.
— Fast open-drain drive capability.
— Capability to register 3-state enable signal.
*
PAL
is a trademark of Advanced Micro Devices, Inc.
IEEE
is a registered trademark of The Institute of Electrical and
Electronics Engineers, Inc.
Table 1.
ORCA
Series 3 FPGAs
Device
OR3T20
OR3T30
OR3C/T55
OR3C/T80
OR3T125
OR3T165
Usable Gates
18K—36K
24K—48K
40K—80K
58K—116K
92K—186K
120K—244K
Max
Registers
1872
2436
3780
5412
8400
10752
Max User
RAM Bits
18K
25K
41K
62K
100K
131K
Max
User I/Os
192
224
288
352
448
512
Array Size
12 x 12
14 x 14
18 x 18
22 x 22
28 x 28
32 x 32
‡ The usable gate counts range from a logic-only gate count to a gate count assuming 30% of the PFUs/SLICs being used as RAMs.
The logic-only gate count includes each PFU/SLIC (counted as 108 gates per PFU/SLIC), including 12 gates per LUT/FF pair (eight per
PFU), and 12 gates per SLIC/FF pair (one per PFU). Each of the four PIOs per PIC is counted as 16 gates (two FFs, fast-capture latch,
output logic, CLK drivers, and I/O buffers). PFUs used as RAM are counted at four gates per bit, with each PFU capable of implementing
a 32 x 4 RAM (or 512 gates) per PFU.

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号