EEWORLDEEWORLDEEWORLD

Part Number

Search

95670-010-01

Description
Telecom and Datacom Connector, 80 Contact(s), Female, Right Angle, Solder Terminal, Locking, Jack
CategoryThe connector    The connector   
File Size515KB,7 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

95670-010-01 Overview

Telecom and Datacom Connector, 80 Contact(s), Female, Right Angle, Solder Terminal, Locking, Jack

95670-010-01 Parametric

Parameter NameAttribute value
MakerAmphenol
Reach Compliance Codecompliant
ECCN codeEAR99
Other features10 PORTS, 8-POSITION EACH
Board mount optionsPEG
body width0.537 inch
subject depth0.854 inch
body length5.62 inch
Body/casing typeJACK
Connector typeTELECOM AND DATACOM CONNECTOR
Contact to complete cooperationAU-PD-NI ON NI
Contact point genderFEMALE
Contact materialPHOSPHOR BRONZE
Contact resistance20 mΩ
Contact styleTELCOM, MODULAR
DIN complianceNO
Durability250 Cycles
empty shellNO
Filter functionYES
IEC complianceNO
maximum insertion force3.4472 N
Insulation resistance500000000 Ω
Insulator colorBLACK
insulator materialTHERMOPLASTIC
MIL complianceNO
Mixed contactsNO
Installation option 1LOCKING
Installation methodRIGHT ANGLE
Installation typeBOARD
Number of ports10
Maximum operating temperature70 °C
Minimum operating temperature-40 °C
OptionsGENERAL PURPOSE
PCB contact patternSTAGGERED
Plating thickness30u inch
GuidelineCSA, UL
reliabilityCOMMERCIAL
Shell surfaceNICKEL
Shell materialBRASS
Terminal length0.125 inch
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts80
PDM: Rev:G
STATUS:
Released
Printed: Feb 19, 2008
.
[Master's Year-end Lecture] Control the last mile: How to prevent performance problems before a major network outage occurs
Keysight Technologies invites technical experts from various fields around the world to communicate online, and there are mysterious gifts for engineers. Interested engineers are welcome to make an ap...
nmg RF/Wirelessly
[Perf-V Review] + Re-understanding of Pengfeng Development Environment
People's growth or learning is often completed in the process of trial and error. My understanding of Pengfeng development environment seems to be verified by it. Due to the dependence on the WINDOW e...
jinglixixi FPGA/CPLD
The differences between the road voltage method, dynamic voltage method, and CEDV compensated discharge termination voltage method, as well as the specific measurement principles
1. Current integration method/Coulomb counter 2.OCV open circuit voltage method 3. Kalman filter method 4. Neural Network Method 5. Impedance TrackTM 6. Dynamic voltage method 7.CEDV Compensated disch...
QWE4562009 Discrete Device
Dielectric strength test/voltage withstand test and ESD static test
Dielectric strength test/voltage withstand test and ESD electrostatic test1. Dielectric strength test/voltage withstand testBetween live parts and unprotected grounded housing, between live parts and ...
QWE4562009 Discrete Device
A silicon microphone was soldered with flying wires
Directly fly the line, no need to draw the board{:1_138:}...
littleshrimp DIY/Open Source Hardware

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号