Microcontroller, 8-Bit, UVPROM, OLMS-65K CPU, 10MHz, CMOS, PQCC68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LAPIS Semiconductor Co., Ltd. |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | 16 |
bit size | 8 |
CPU series | OLMS-65K |
DAC channel | NO |
DMA channel | NO |
External data bus width | 8 |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e0 |
length | 24.23 mm |
Number of I/O lines | 56 |
Number of terminals | 68 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 640 |
rom(word) | 32768 |
ROM programmability | UVPROM |
speed | 12 MHz |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 2.7 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 24.23 mm |
MSM65P516JS | MSM65516SS | MSM65516JS | |
---|---|---|---|
Description | Microcontroller, 8-Bit, UVPROM, OLMS-65K CPU, 10MHz, CMOS, PQCC68 | Microcontroller, 8-Bit, MROM, OLMS-65K CPU, 10MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, MROM, OLMS-65K CPU, 10MHz, CMOS, PQCC68 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |
Reach Compliance Code | unknown | unknown | unknow |
Has ADC | NO | NO | NO |
Address bus width | 16 | 16 | 16 |
bit size | 8 | 8 | 8 |
CPU series | OLMS-65K | OLMS-65K | OLMS-65K |
DAC channel | NO | NO | NO |
DMA channel | NO | NO | NO |
External data bus width | 8 | 8 | 8 |
JESD-30 code | S-PQCC-J68 | R-PDIP-T64 | S-PQCC-J68 |
JESD-609 code | e0 | e0 | e0 |
length | 24.23 mm | 57.6 mm | 24.23 mm |
Number of I/O lines | 56 | 57 | 56 |
Number of terminals | 68 | 64 | 68 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
PWM channel | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | SDIP | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ | SDIP64,.75 | LDCC68,1.0SQ |
Package shape | SQUARE | RECTANGULAR | SQUARE |
Package form | CHIP CARRIER | IN-LINE, SHRINK PITCH | CHIP CARRIER |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 640 | 640 | 640 |
rom(word) | 32768 | 32768 | 32768 |
ROM programmability | UVPROM | MROM | MROM |
speed | 12 MHz | 12 MHz | 12 MHz |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | J BEND |
Terminal pitch | 1.27 mm | 1.778 mm | 1.27 mm |
Terminal location | QUAD | DUAL | QUAD |
width | 24.23 mm | 19.05 mm | 24.23 mm |