EEWORLDEEWORLDEEWORLD

Part Number

Search

ERJ8GEYJ160V

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 16ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size83KB,2 Pages
ManufacturerPanasonic
Websitehttp://www.panasonic.co.jp/semicon/e-index.html
Environmental Compliance  
Download Datasheet Parametric View All

ERJ8GEYJ160V Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 16ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1206, CHIP, ROHS COMPLIANT

ERJ8GEYJ160V Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPanasonic
package instructionCHIP
Reach Compliance Codecompliant
Factory Lead Time12 weeks
Other featuresIEC60115-8
structureRECTANGULAR PACKAGE
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.6 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTR, PUNCHED, 7 INCH
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance16 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage200 V
Thick Film Chip Resistors
Thick Film Chip Resistors
01005, 0201, 0402, 0603, 0805,
1206, 1210, 1812, 2010, 2512
Type:
ERJ XG, 1G, 2G, 3G, 6G, 8G,
14, 12, 12Z, 1T
Features
Small size and lightweight
High reliability
Metal glaze thick film resistive element and three layers of electrodes
Compatible with placement machines
Taping packaging available
Suitable for both reflow and flow soldering
Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
RoHS compliant
Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Data Files
Explanation of Part Numbers
ERJXGN, 1GN, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type
1
2
3
4
5
6
7
8
9
10
11
12
Product Code
Thick Film
Chip Resistors
Size, Power Rating
Type : inch
Power R.
XGN : 01005 0.031 W
0.05 W
1GN : 0201
0.1 W
2GE : 0402
0.1 W
3GE : 0603
0.125 W
6GE : 0805
0.25 W
8GE : 1206
0.5 W
14 : 1210
0.75 W
12 : 1812
0.75 W
12Z : 2010
1W
1T : 2512
Code
Y
Nil
Marking
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±5 %
Jumper
Code
Y
U
C
X
Y
Packaging Methods
Packaging
Pressed Carrier Taping
W8P2, 20,000 pcs.
Embossed Carrier Taping
W4P1, 40,000 pcs.
Type
ERJXGN
Resistance Value
The first two digits are significant figures of resistance and
the third one denotes number of zeros following.
Decimal Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Pressed Carrier Taping
2 mm pitch, 15,000 pcs. ERJ1GN
Punched Carrier Taping
2 mm pitch, 10,000 pcs.
Punched Carrier Taping
2 mm pitch, 20,000 pcs.
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
ERJ2GE
V
½
When omitted, the rest of the P/N factors shall be moved up respectively.
(Only XGN, 1GN, 2GE type)
U
ERJ3GE
ERJ6GE
ERJ8GE
ERJ14
Embossed Carrier Taping
ERJ12
4 mm pitch, 5,000 pcs.
ERJ12Z
Embossed Carrier Taping
ERJ1T
4 mm pitch, 4,000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Aug. 2012
–3–
Internal functions of MSP430
Internal functions: some special functions for the target CPU provided by the compiler, as well as commonly used functions that have been highly optimized through assembly. The internal functions prov...
fish001 Microcontroller MCU
When filling out college entrance examination applications, which majors must be chosen carefully?
When filling out college entrance examination applications, which majors must be carefully selected? What are the reasons?Tell us about your personal experience....
eric_wang Talking
Differences between CPU and CLA and Error Handling Techniques
The C2000 microprocessor with C28x+FPU architecture adds some registers and instructions to the original C28x fixed-point CPU to support IEEE single-precision floating-point operations. For programs w...
灞波儿奔 Microcontroller MCU
EEWORLD University Hall ---- Pattern Recognition National University of Defense Technology Cai Xuanping
Pattern Recognition Xuanping Cai from National University of Defense Technology : https://training.eeworld.com.cn/course/5214Pattern recognition is a subject of data processing and information analysi...
木犯001号 Industrial Control Electronics
ST32F103x Read the sensor value on X-NUCLEO-IKS01A3 via I2C
[i=s]This post was last edited by zdzd23 on 2019-10-6 23:52[/i]First, the wiring: 3.3V, GND, SCL, SDA Predefined code:/*Chip address*/#define LSM6DSO_ADRESS 0XD6#define LIS2MDL_ADRESS 0X3C#define LIS2...
zdzd23 ST Sensors & Low Power Wireless Technology Forum
Need help designing a CAN communication solution between two MCUs!
There are two STM32 MCUs on the board. Due to design limitations, the two MCUs are going to use CAN communication, but I don't want to add interface chips such as TAJ1050. Can I directly connect the R...
bioger stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号