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MC78LC00 Series
Micropower Voltage
Regulator
The MC78LC00 series of fixed output low dropout linear regulators
are designed for handheld communication equipment and portable
battery powered applications which require low quiescent current. The
MC78LC00 series features an ultra−low quiescent current of 1.1
mA.
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, and resistors for setting output voltage.
The MC78LC00 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1
mF.
The
device is housed in the micro−miniature Thin SOT23−5 surface mount
package and SOT−89, 3 pin. Standard voltage versions are 1.5, 1.8,
2.5, 2.7, 2.8, 3.0, 3.3, 4.0, and 5.0 V. Other voltages are available in
100 mV steps.
Features
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MARKING DIAGRAMS AND
PIN CONNECTIONS
TSOP−5
NTR SUFFIX
CASE 483
5
1
GND
V
in
V
out
1
XXX
AYW
G
G
5 N/C
2
3
•
•
•
•
•
•
•
•
Low Quiescent Current of 1.1
mA
Typical
Excellent Line and Load Regulation
Maximum Operating Voltage of 12 V
Low Output Voltage Option
High Accuracy Output Voltage of 2.5%
Industrial Temperature Range of
−40°C
to 85°C
Two Surface Mount Packages (SOT−89, 3 Pin, or SOT−23, 5 Pin)
These are Pb−Free Devices
4 N/C
(Top View)
SOT−89
H SUFFIX
CASE 1213
TAB
1
GND 1
V
in
2
V
out
3
XXAYW
G
G
Tab
Typical Applications
(Top View)
(Tab is connected to Pin 2)
•
Battery Powered Instruments
•
Hand−Held Instruments
•
Camcorders and Cameras
V
in
2
3
V
O
XXX= Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
V
ref
1
This device contains 8 active transistors.
GND
Figure 1. Representative Block Diagram
©
Semiconductor Components Industries, LLC, 2009
January, 2009
−
Rev. 10
1
Publication Order Number:
MC78LC00/D
MC78LC00 Series
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PIN FUNCTION DESCRIPTION
Pin No.
1
2
3
4
5
Pin Name
GND
V
in
Description
Power supply ground
Positive power supply input voltage
Regulated Output
V
out
N/C
N/C
No Internal Connection
No Internal Connection
MAXIMUM RATINGS
Input Voltage
Rating
Symbol
V
in
Value
12
Unit
V
V
Output Voltage
V
out
−0.3
to V
in
+0.3
Power Dissipation and Thermal Characteristics
Case 483−01 (Thin SOT23−5) NTR Suffix
Power Dissipation @ T
A
= 85°C
Thermal Resistance, Junction−to−Ambient
Case 1213 (SOT−89) H Suffix
Power Dissipation @ T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature
P
D
R
qJA
P
D
R
qJA
T
J
T
A
140
280
900
111
mW
°C/W
mW
°C/W
°C
°C
°C
+125
−40
to +85
T
stg
−55
to +150
10
Lead Soldering Temperature @ 260°C
T
solder
sec
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
2
MC78LC00 Series
ELECTRICAL CHARACTERISTICS
(V
in
= V
out(nom.)
+ 1.0 V, C
in
= 1.0
mF,
C
out
= 1.0
mF,
T
J
= 25°C, unless otherwise noted.) (Note 5)
NTR SUFFIX
Characteristic
Output Voltage (T
A
= 25°C, I
out
= 1.0 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Output Voltage (T
A
=
−40°C
to 85°C)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
4.0 V
5.0 V
Line Regulation (V
in
= V
O(nom.)
+ 1.0 V to 12 V, I
out
= 1.0 mA)
Load Regulation (I
out
= 1.0 mA to 10 mA)
Output Current (Note 6)
1.5 V, 1.8 V (V
in
= 4.0 V)
2.5 V, 2.7 V, 2.8 V, 3.0 V (V
in
= 5.0 V)
3.3 V (V
in
= 6.0 V)
4.0 V (V
in
= 7.0 V)
5.0 V (V
in
= 8.0 V)
Dropout Voltage (I
out
= 1.0 mA, Measured at V
out
−3.0%)
1.5 V
1.6 V−3.2 V
3.3 V−3.9 V
4.0 V−5.0 V
Quiescent Current (I
out
= 1.0 mA to I
O(nom.)
)
Output Voltage Temperature Coefficient
Output Noise Voltage (f = 1.0 kHz to 100 kHz)
Symbol
V
out
Min
1.455
1.746
2.425
2.646
2.744
2.94
3.234
3.9
4.90
1.455
1.746
2.425
2.619
2.716
2.910
3.201
3.9
4.90
−
−
35
50
50
80
80
−
−
−
−
−
−
−
Typ
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
1.5
1.8
2.5
2.7
2.8
3.0
3.3
4.0
5.0
0.05
40
50
80
80
80
100
35
30
30
30
1.1
"100
89
Max
1.545
1.854
2.575
2.754
2.856
3.06
3.366
4.1
5.10
1.545
1.854
2.575
2.781
2.884
3.09
3.399
4.1
5.10
0.2
60
−
−
−
−
−
70
60
53
38
3.6
−
−
Unit
V
V
out
V
Reg
line
Reg
load
I
out
%/V
mV
mA
V
in
−V
out
mV
I
Q
T
c
mA
ppm/°C
mVrms
V
n
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C)
"100
mA
3. Maximum package power dissipation limits must be observed.
TJ(max)
*
TA
PD
+
R
qJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Output Current is measured when V
out
= V
O1
−
3% where V
O1
= V
out
at I
out
= 0 mA.
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3
MC78LC00 Series
ELECTRICAL CHARACTERISTICS
(V
in
= V
out(nom.)
+ 1.0 V, C
in
= 1.0
mF,
C
out
= 1.0
mF,
T
J
= 25°C, unless otherwise noted.) (Note 11)
HT SUFFIX
Characteristic
Output Voltage
30HT1 Suffix (V
in
= 5.0 V)
33HT1 Suffix (V
in
= 5.0 V)
40HT1 Suffix (V
in
= 6.0 V)
50HT1 Suffix (V
in
= 7.0 V)
Line Regulation
V
in
= [V
O
+ 1.0] V to 10 V, I
O
= 1.0 mA
Load Regulation (I
O
= 1.0 to 10 mA)
30HT1 Suffix (V
in
= 5.0 V)
33HT1 Suffix (V
in
= 6.0 V)
40HT1 Suffix (V
in
= 7.0 V)
50HT1 Suffix (V
in
= 8.0 V)
Output Current (Note 12)
30HT1 Suffix (V
in
= 5.0 V)
33HT1 Suffix (V
in
= 6.0 V)
40HT1 Suffix (V
in
= 7.0 V)
50HT1 Suffix (V
in
= 8.0 V)
Reg
line
Symbol
Min
2.950
3.218
3.900
4.875
−
Typ
3.0
3.3
4.0
5.0
0.05
Max
3.075
3.382
4.100
5.125
0.2
Unit
V
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Á Á
Á Á Á
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Á Á
Á Á Á
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Á Á Á
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Á Á Á
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Á Á Á
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Á Á Á
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Á Á Á
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Á Á
Á Á Á
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Á Á Á
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Á Á
Á Á Á
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Á Á
Á Á Á
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Á Á
Á Á Á
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Á Á
Á Á Á
%/V
mV
Reg
load
−
−
−
−
40
40
50
60
50
50
65
80
40
35
25
25
60
60
70
90
−
−
−
−
I
O
35
35
45
55
−
−
−
−
−
−
−
−
−
mA
Dropout Voltage
30HT1 Suffix (I
O
= 1.0 mA)
33HT1 Suffix (I
O
= 1.0 mA)
40HT1 Suffix (I
O
= 1.0 mA)
50HT1 Suffix (I
O
= 1.0 mA)
Quiescent Current
30HT1 Suffix (V
in
= 5.0 V)
33HT1 Suffix (V
in
= 5.0 V)
40HT1 Suffix (V
in
= 6.0 V)
50HT1 Suffix (V
in
= 7.0 V)
V
in
−
V
O
60
53
38
38
mV
I
CC
1.1
1.1
1.2
1.3
3.3
3.3
3.6
3.9
−
mA
Output Voltage Temperature Coefficient
T
C
±100
ppm/°C
7. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
8. Latch up capability (85°C)
"100
mA
9. Maximum package power dissipation limits must be observed.
TJ(max)
*
TA
PD
+
R
qJA
10. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
12. Output Current is measured when V
out
= V
O1
−
3% where V
O1
= V
out
at I
out
= 0 mA.
DEFINITIONS
Load Regulation
The change in output voltage for a change in output current
at a constant temperature.
Dropout Voltage
difference between the input current (measured through the
LDO input pin) and the output current.
Line Regulation
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3% below its
nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
Line Transient Response
The maximum total dissipation for which the regulator will
operate within its specifications.
Quiescent Current
Typical over and undershoot response when input voltage is
excited with a given slope.
Maximum Package Power Dissipation
The quiescent current is the current which flows through the
ground when the LDO operates without a load on its output:
internal IC operation, bias, etc. When the LDO becomes
loaded, this term is called the Ground current. It is actually the
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
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