LE79231QC datasheet, PDF - EEWORLD Datasheet

LE79231QC: DescriptionSLIC, Bipolar, 8 X 8 MM, MO-220, QFN-32; CategoryWireless rf/communication Telecom circuit; File Size641KB，24 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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LE79231QC Overview

SLIC, Bipolar, 8 X 8 MM, MO-220, QFN-32

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Objectid	1846163797
Parts packaging code	QFN
package instruction	8 X 8 MM, MO-220, QFN-32
Contacts	32
Reach Compliance Code	unknown
compound_id	6926281
JESD-30 code	S-XQCC-N32
JESD-609 code	e3
length	8 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	265
Certification status	Not Qualified
Maximum seat height	1 mm
Nominal supply voltage	5 V
surface mount	YES
technology	BIPOLAR
Telecom integrated circuit types	SLIC
Temperature level	COMMERCIAL
Terminal surface	MATTE TIN
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

	LE79231QC	LE79231FQC	LE79231JC
Description	SLIC, Bipolar, 8 X 8 MM, MO-220, QFN-32	SLIC, Bipolar, 8 X 8 MM, GREEN, MO-220, QFN-32	SLIC, Bipolar, PQCC32, PLASTIC, MS-016, LCC-32
Is it Rohs certified?	incompatible	conform to	incompatible
Objectid	1846163797	1846163794	1846163796
Parts packaging code	QFN	QFN	LCC
package instruction	8 X 8 MM, MO-220, QFN-32	HVQCCN,	PLASTIC, MS-016, LCC-32
Contacts	32	32	32
Reach Compliance Code	unknown	compliant	unknown
JESD-30 code	S-XQCC-N32	S-XQCC-N32	R-PQCC-J32
length	8 mm	8 mm	13.97 mm
Number of functions	1	1	1
Number of terminals	32	32	32
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN	QCCJ
Package shape	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm	3.556 mm
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR
Telecom integrated circuit types	SLIC	SLIC	SLIC
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	J BEND
Terminal pitch	0.8 mm	0.8 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD
width	8 mm	8 mm	11.43 mm
Is it lead-free?	Contains lead	Lead free	-
Maker	Microsemi	Microsemi	-
compound_id	6926281	6926280	-

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