PXB4330E datasheet, PDF - EEWORLD Datasheet

PXB4330E: DescriptionSupport Circuit, 1-Func, CMOS, PBGA352, HEAT SINK, PLASTIC, BGA-352; CategoryWireless rf/communication Telecom circuit; File Size2MB，201 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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PXB4330E Overview

Support Circuit, 1-Func, CMOS, PBGA352, HEAT SINK, PLASTIC, BGA-352

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	HEAT SINK, PLASTIC, BGA-352
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	35 mm
Number of functions	1
Number of terminals	352
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HLBGA
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.58 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35 mm

	PXB4330E
Description	Support Circuit, 1-Func, CMOS, PBGA352, HEAT SINK, PLASTIC, BGA-352
Is it Rohs certified?	incompatible
Maker	Intel
package instruction	HEAT SINK, PLASTIC, BGA-352
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	35 mm
Number of functions	1
Number of terminals	352
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HLBGA
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.58 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35 mm

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