IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-PDIP-T14 |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
SN74H87N1 | SN74H87NP3 | SN74H87J4 | SN74H87N3 | SN74H87JP4 | SN74H87NP1 | |
---|---|---|---|---|---|---|
Description | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,PLASTIC | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,PLASTIC | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,CERAMIC | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,PLASTIC | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,CERAMIC | IC,TRUE/COMPLEMENT ELEMENT,H-TTL,DIP,14PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 code | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |