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K2C110FMD1TH

Description
Board Connector, 110 Contact(s), 6 Row(s), Male, Straight, Solder Terminal
CategoryThe connector    The connector   
File Size2MB,14 Pages
ManufacturerHypertronics Corporation
Download Datasheet Parametric View All

K2C110FMD1TH Overview

Board Connector, 110 Contact(s), 6 Row(s), Male, Straight, Solder Terminal

K2C110FMD1TH Parametric

Parameter NameAttribute value
MakerHypertronics Corporation
Reach Compliance Codeunknown
Other featuresSTANDARD: IEC 1076-4 101, MIL-DTL-55302, SHIELDED
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (50) OVER NICKEL
Contact completed and terminatedGOLD (50) OVER NICKEL
Contact point genderMALE
DIN complianceYES
Filter functionNO
IEC complianceNO
JESD-609 codee4
MIL complianceYES
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded6
OptionsGENERAL PURPOSE
Terminal pitch2 mm
Termination typeSOLDER
Total number of contacts110
UL Flammability Code94V-0
cPCI Series (2mm)
cPCI Series (2mm) Connectors
Interchangeable with cPCI COTS Systems
Hi-Rel and Space Grade Versions
Standard 2mm Footprint of cPCI PICMG 2.0
Immune to Shock and Vibration
LCP Insulator meets NASA Outgassing Requirements
Compatible with IEC 1076-4 101
Press-Fit Termination also available for Receptacle
Assembly: Consult Factory
• NASA GSFC Qualified Part Numbers Available
Subject to Export Control Procedure
Qualification Testing
The 2mm cPCI family of connectors meets MIL-DTL-55302, EEE-INST-002, GEVS-SE Rev. A, and NASA GSFC
S-311-P-822 specifications.
Testing includes but is not limited to:
LLCR:
Low Level Contact Resistance
DWV:
CRD:
Dielectric Withstanding Voltage
Contact Resistance
IR:
MFG:
S & V:
Insultation Resistance
Mixed Flowing Gas
Shock and Vibration
General Specifications
QCI (Quality Conformance Inspections) K2 Series = MIL-DTL-55302 311P Series = NASA GSFC S-311-P-822
3U / 6U Form Factor
Part Number Reference
Design Criteria
Contact Gender
Contact Termination
Contact Spacing
Number of Contacts
Contact Current Rating
Temperature Range
Insulator Material
Flammability Rating
Insulation Resistance
Contact Material
Mating Contact Plating
Maximum Allowable Gap
Between Mating Connectors
Suggested Printed Circuit
Board Hole Diameter
Weight
0.55 oz.
0.70mm after plating
0.53 oz.
0.38 oz.
0.38 oz.
Beryllium copper pin contacts
110 signal
22 ground
95 signal
19 ground
1 Amp
-55° C to 125° C
30% Glass Filled LCP (meets NASA outgassing specification)
94 V-O
> 5000 megohm
Beryllium copper Hypertac socket wires and brass body
50µin gold / 50µin nickel
0.059 [1.50]
0.60mm after plating
0.45 oz.
0.31 oz.
Male Pin
P1 / P4
K2A110FMD
P2 / P5
K2B110FMD
P3
K2B95FMD
J1 / J4
K2A110FFD
J2 / J5
K2B110FFD
J3
K2B95FFD
IEC 1076-4 101
Hypertac 0.40mm socket
Solder tail tin/lead (63/37) per MIL-P-81728
2.00mm
110 signal
22 ground
95 signal
19 ground
Dimensions are in inches [mm]
www.hypertronics.com
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