Microcontroller, 8-Bit, EPROM, Z8 CPU, 12.5MHz, CMOS, CDIP40
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IXYS |
Parts packaging code | DIP |
Contacts | 40 |
Reach Compliance Code | unknown |
bit size | 8 |
CPU series | Z8 |
JESD-30 code | R-XDIP-T40 |
JESD-609 code | e0 |
length | 52.325 mm |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 124 |
rom(word) | 4096 |
ROM programmability | EPROM |
speed | 12.5 MHz |
Maximum slew rate | 150 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Z08613-12TSF | |
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Description | Microcontroller, 8-Bit, EPROM, Z8 CPU, 12.5MHz, CMOS, CDIP40 |
Is it Rohs certified? | incompatible |
Maker | IXYS |
Parts packaging code | DIP |
Contacts | 40 |
Reach Compliance Code | unknown |
bit size | 8 |
CPU series | Z8 |
JESD-30 code | R-XDIP-T40 |
JESD-609 code | e0 |
length | 52.325 mm |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 124 |
rom(word) | 4096 |
ROM programmability | EPROM |
speed | 12.5 MHz |
Maximum slew rate | 150 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |