IC IC,D/A CONVERTER,DUAL,12-BIT,BICMOS,DIP,24PIN, Digital to Analog Converter
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | ADI |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Converter type | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.012% |
Number of digits | 12 |
Number of functions | 2 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 12/15 V |
Maximum stabilization time | 1.5 µs |
Maximum slew rate | 2 mA |
surface mount | NO |
technology | BICMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
AD7537KN/+ | AD7537JN/+ | AD7537LN/+ | |
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Description | IC IC,D/A CONVERTER,DUAL,12-BIT,BICMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,DUAL,12-BIT,BICMOS,DIP,24PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,DUAL,12-BIT,BICMOS,DIP,24PIN, Digital to Analog Converter |
Is it lead-free? | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | ADI | ADI | ADI |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609 code | e0 | e0 | e0 |
Maximum linear error (EL) | 0.012% | 0.024% | 0.012% |
Number of digits | 12 | 12 | 12 |
Number of functions | 2 | 2 | 2 |
Number of terminals | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 12/15 V | 12/15 V | 12/15 V |
Maximum stabilization time | 1.5 µs | 1.5 µs | 1.5 µs |
Maximum slew rate | 2 mA | 2 mA | 2 mA |
surface mount | NO | NO | NO |
technology | BICMOS | BICMOS | BICMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |