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KM23C8001A-25

Description
MASK ROM, 1MX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size55KB,1 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

KM23C8001A-25 Overview

MASK ROM, 1MX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

KM23C8001A-25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time250 ns
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length41.91 mm
memory density8388608 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.05 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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