APL3218
Li+ Charger Protection IC
Features
•
•
•
•
•
•
•
•
•
•
Provide OUT Pin 5V Voltage Clamping Protection
General Description
The APL3218 provides complete Li+ charger protection
against Input over-voltage, input over-current and over-
temperature. When any of the monitored parameters is
over the threshold, the IC turns off the charging current.
All protections also have deglitch time against false trig-
gering due to voltage spikes or current transients.
The APL3218 integrates a 5.5V LDO to prevent ACIN over-
shoot reaching CHR_LDO and OUT. When any transient
peak voltage above 5.5V presenting in ACIN pin, but be-
low OVP threshold, the internal LDO will clamp its output
at 5.5V. When ACIN voltage exceeds OVP threshold, the
device will turn off charging current. The charging current
is controlled by the GATDRV pin. When sourcing a cur-
rent from the GATDRV pin, the OUT pin delivers the charg-
ing current which is 200-fold magnified in amplitude
based on GATDRV’ current.
s
Other features include accurate V
VCDT
/V
ACIN
Voltage divider,
reverse current blocking from OUT to ACIN and OTP
protection. The APL3218 provides complete Li+ charger
protections, and saves the external MOSFET and Schottky
diode for the charger of cell phone’ PMIC. The above
s
features and small package make the APL3218 an ideal
part for cell phones applications.
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
•
Thermal Charging Regulation Protection
Provide Input Over-voltage Protection
Provide Input Over-current Protection
Provide Over Temperature Protection
Provide Reverse Current Blocking
High Immunity of False Triggering
High Accuracy Protection Threshold
Low On Resistance 0.75Ω Typ.
Compact TDFN2x2-8 and DFN3x3-8 Packages
Lead Free and Green Devices Available
(RoHS Compliant)
Applications
•
Cell Phones
Pin Configuration
ACIN 1
ACIN 2
GND 3
VCDT 4
Simplified Application Circuit
5V
Adapter
ACIN CHR_LDO
CHR_LDO
DFN3x3-8
(Top View)
APL3218
GATDRV
PMIC
GATDRV
VCDT
ISENS
ACIN 1
ACIN 2
GND 3
VCDT 4
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
VCDT
OUT
GND
Li+
Battery
VBAT
TDFN2x2-8
(Top View)
= Exposed Pad (connected to ground
plane for better heat dissipation)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Apr., 2012
1
www.anpec.com.tw
APL3218
Ordering and Marking Information
APL3218
Assembly Material
Handling Code
Temperature Range
Package Code
L18
X
APL
3218
XXXXX
Package Code
QA : DFN3x3-8
QB : TDFN2x2-8
Operating Ambient Temperature Range
I : -40 to 85
o
C
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
X - Date Code
APL3218 QB:
APL3218 QA:
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
V
ACIN
V
CHR_LDO
V
GATDRV
V
CDT
V
OUT
I
OUT
T
J
T
STG
T
SDR
CHR_LDO to GND Voltage
GATDRV to GND Voltage
VCDT to GND Voltage
OUT to GND Voltage
Output Current (OUT to GND)
Maximum Junction Temperature
Storage Temperature
ACIN Input Voltage (ACIN to GND)
(Note 1)
Parameter
Rating
-0.3 ~ 20
-0.3 ~ 7
-0.3 ~ V
CHR_LDO
-0.3 ~ 7
-0.3 ~ 7
1.5
150
-65 ~ 150
260
Unit
V
V
V
V
V
A
o
o
C
C
C
Maximum Lead Soldering Temperature (10 Seconds)
o
Note 1:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recom-
mended operating conditions”is not implied. Exposure to absolute maximum rating conditions for extended periods may affect vice
reliability.
Thermal Characteristic
Symbol
θ
JA
θ
JA
Parameter
TDFN2x2-8 Junction-to-Ambient Resistance in free air
(Note 2)
DFN3x3-8 Junction-to-Ambient Resistance in free air
(Note 2)
Typical Value
75
65
Unit
o
o
C/W
C/W
Note 2:
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed
pad of TDFN2x2-8 is soldered directly on the PCB.
Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Apr., 2012
2
www.anpec.com.tw
APL3218
Recommended Operating Conditions
Symbol
V
ACIN
I
OUT
T
A
T
J
C
CHR_LDO
ACIN Input Voltage
Output Current
Ambient Temperature
Junction Temperature
CHR_LDO Output Capacitor
Parameter
(Note 3)
Range
4.5 ~ 9
0 ~ 0.7
-40 ~ 85
-40 ~ 125
1
Unit
V
A
o
o
C
C
µF
Note 3: Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over V
ACIN
=5V, T
A
= -40 ~ 85
o
C. Typical values are at T
A
=25
o
C.
Symbol
Parameter
Test Conditions
Min.
ACIN INPUT CURRENT and POWER-ON-RESET (POR)
I
ACIN
V
POR
ACIN Supply Current
ACIN POR Threshold
ACIN POR Hysteresis
T
B(ACIN)
ACIN Power-On Blanking Time
IOUT=0A, CHR_LDO and GATDRV open
V
ACIN
rising
-
2.4
-
-
350
2.6
250
8
600
2.8
-
-
µA
V
mV
ms
Ω
Ω
APL3218
Typ.
Max.
Unit
INTERNAL SWITCH ON RESISTANCE
ACIN to OUT On Resistance
I
OUT
= 0.7A
-
-
0.75
500
-
-
CHR_LDO Discharge
V
ACIN
= 12V , V
CHR_LDO
= 2V
Resistnace
INPUT OVER-VOLTAGE PROTECTION (OVP)
V
REG
Internal LDO Output Voltage
CHR_LDO Output Series
Resistance
Input OVP Threshold
Input OVP Hysteresis
T
OVP
T
ON(OVP)
Input OVP Propagation Delay
Input OVP recovery time
V
ACIN
= 7V, I
OUT
= 10mA, T
J
= -40 ~ 125
o
C
5.225
2.4
5.5
3
10
200
-
1
5.775
3.6
10.5
-
1
-
V
kΩ
V
mV
µs
ms
V
OVP
V
ACIN
rising, T
J
= -40 ~ 125
o
C
9.5
-
-
-
OVER-CURRENT PROTECTION (OCP)
I
OC
I
CL
Over-Current Trip Threshold
Current Limit Level
T
J
= 25
o
C
T
J
= 25
o
C
1.05
0.84
1.5
1.2
1.95
1.56
A
A
VCDT INTERNAL DIVIDER
Divider Ratio
CHARGE CURRENT CONTROL
Current Mirror Gain
REVERSE CURRENT BLOCKING
PMOS Lockout Threshold
PMOS Lockout Release
Threshold
OUT Input Current (Reverse
Current Blocking)
-
-
V
ACIN
= 0V, V
OUT
= 4.2V, V
GATDRV
=0V
-
20
100
-
-
-
1
mV
mV
µA
I
OUT
= 0.6A, I
OUT
/I
GATDRV
100
200
300
A/A
V
VCDT
/V
ACIN
0.1035
0.1056
0.1078
V/V
Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Apr., 2012
3
www.anpec.com.tw
APL3218
Electrical Characteristics (Cont.)
Unless otherwise specified, these specifications apply over V
ACIN
=5V, T
A
= -40 ~ 85
o
C. Typical values are at T
A
=25
o
C.
Symbol
Parameter
Test Conditions
Min.
OUT OVERSHOOT CLAMP
V
CLAMP
Overshoot Clamp Rising
Threshold
Overshoot Clamp Pull Low
Resistance
Overshoot Clamp Active Time
THERMAL SHUTDOWN PROTECTION
T
OTP
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
T
J
rising
-
-
160
40
-
-
o
o
APL3218
Typ.
Max.
Unit
V
OUT
rising slew rate > 0.2V/µs
V
OUT
rising slew rate > 0.2V/µs
From Overshoot Clamp Threshold being
surpassed
4.6
-
-
-
3
150
5.2
-
-
V
Ω
µs
C
C
Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Apr., 2012
4
www.anpec.com.tw
APL3218
Typical Operating Characteristics
ACIN Supply Current vs. ACIN Input
Voltage
600
T
J
=25
o
C
600
ACIN Supply Current vs. Junction
Temperature
V
ACIN
=5V
ACIN Supply Current , I
ACIN
(uA)
ACIN Supply Current , I
ACIN
(uA)
0
1
2
3
4
5
6
7
8
9
500
400
300
200
100
0
550
500
450
400
350
300
250
200
-50
-25
0
25
50
75
100
125
ACIN Input Voltage (V)
Junction Temperature (
o
C)
Over Current Trip Threshold vs.
Junction Temperature
2.0
1.6
1.4
Current Limit Level vs. Junction
Temperature
V
ACIN
=5V
Over Current Trip Threshold, I
OC
(A)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50
V
ACIN
=5V
Current Limit Level , I
CL
(A)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-25
0
25
50
75
o
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature ( C)
Junction Temperature (
o
C)
ACIN POR Threshold vs. Junction
2.8
Input OVP Threshold vs. Junction
10.5
Temperature
Input OVP Threshold, V
OVP
(V)
Temperature
ACIN POR Threshold, V
POR
(V)
2.7
V
ACIN
Rising
2.6
2.5
2.4
2.3
2.2
2.1
2.0
-50
-25
0
25
50
75
100
125
V
ACIN
Falling
10.4
10.3
10.2
10.1
10.0
9.9
9.8
9.7
9.6
9.5
-50
-25
0
25
50
75
100
125
V
ACIN
Falling
V
ACIN
Rising
Junction Temperature (
o
C)
Copyright
©
ANPEC Electronics Corp.
Rev. A.1 - Apr., 2012
5
Junction Temperature (
o
C)
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