DD256M42U3BA7 datasheet, PDF - EEWORLD Datasheet

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DD256M42U3BA7: DescriptionDDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, FBGA-66; Categorystorage storage; File Size109KB，4 Pages; ManufacturerVertical Circuits Inc.

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DD256M42U3BA7 Overview

DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, FBGA-66

DD256M42U3BA7 Parametric

Parameter Name	Attribute value
Maker	Vertical Circuits Inc.
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	66
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Other features	CAS BEFORE RAS REFRESH
JESD-30 code	R-PBGA-B66
JESD-609 code	e0
length	12 mm
memory density	1073741824 bit
Memory IC Type	DDR DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	66
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
organize	256MX4
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.35 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	10 mm

DD256M42U3BA7 Related Products

	DD256M42U3BA7	DD256M42U3BA5	DD256M42U3BB7	DD256M42U3BB5	DD256M42U3BB6	DD256M42U3BA6
Description	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, FBGA-66	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, FBGA-66	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, LEAD FREE, FBGA-66	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, LEAD FREE, FBGA-66	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, LEAD FREE, FBGA-66	DDR DRAM, 256MX4, CMOS, PBGA66, 10 X 12 MM, 1.35 MM HEIGHT, FBGA-66
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA,	LFBGA,	LFBGA,	LFBGA,	LFBGA,	LFBGA,
Contacts	66	66	66	66	66	66
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	CAS BEFORE RAS REFRESH	CAS BEFORE RAS REFRESH	CAS BEFORE RAS REFRESH	CAS BEFORE RAS REFRESH	CAS BEFORE RAS REFRESH	CAS BEFORE RAS REFRESH
JESD-30 code	R-PBGA-B66	R-PBGA-B66	R-PBGA-B66	R-PBGA-B66	R-PBGA-B66	R-PBGA-B66
JESD-609 code	e0	e0	e1	e1	e1	e0
length	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm
memory density	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	66	66	66	66	66	66
word count	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words
character code	256000000	256000000	256000000	256000000	256000000	256000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	256MX4	256MX4	256MX4	256MX4	256MX4	256MX4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.35 mm	1.35 mm	1.35 mm	1.35 mm	1.35 mm	1.35 mm
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.5 V	2.3 V	2.5 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.6 V	2.5 V	2.6 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal surface	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm
Maker	Vertical Circuits Inc.	-	Vertical Circuits Inc.	Vertical Circuits Inc.	Vertical Circuits Inc.	Vertical Circuits Inc.

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