Fast Page DRAM Module, 256KX8, 60ns, CMOS, SIMM-30
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Parts packaging code | SIMM |
| package instruction | SIMM-30 |
| Contacts | 30 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 60 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O type | COMMON |
| JESD-30 code | R-XSMA-N30 |
| memory density | 2097152 bit |
| Memory IC Type | FAST PAGE DRAM MODULE |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 30 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | SIMM |
| Encapsulate equivalent code | SIM30 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum seat height | 12.954 mm |
| Maximum standby current | 0.0004 A |
| Maximum slew rate | 0.18 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | NO LEAD |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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