M25P20SVMN3G/X datasheet, PDF - EEWORLD Datasheet

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M25P20SVMN3G/X: DescriptionFlash, 256KX8, PDSO8; Categorystorage storage; File Size1MB，55 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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M25P20SVMN3G/X Overview

Flash, 256KX8, PDSO8

M25P20SVMN3G/X Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Micron Technology
package instruction	SOP, SOP8,.25
Reach Compliance Code	compliant
Maximum clock frequency (fCLK)	25 MHz
Data retention time - minimum	20
Durability	10000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
memory density	2097152 bit
Memory IC Type	FLASH
memory width	8
Number of terminals	8
word count	262144 words
character code	256000
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	256KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
power supply	3/3.3 V
Certification status	Not Qualified
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.015 mA
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
type	NOR TYPE
write protect	HARDWARE/SOFTWARE

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M25P20

2 Mbit, low voltage, Serial Flash memory

with 75 MHz SPI bus interface

Feature summary

2 Mbit of Flash Memory

Page Program (up to 256 Bytes) in 0.8 ms

(typical)

Sector Erase (512 Kbit) in 0.6 s (typical)

Bulk Erase (2 Mbit) in 3 s (typical)

2.3 to 3.6 V Single Supply Voltage

SPI Bus Compatible Serial Interface

75 MHz Clock Rate (maximum)

Deep Power-down Mode 1

μA

(typical)

Hardware Write Protection: protected area

size defined by two non-volatile bits (BP0,

BP1)

Electronic Signatures

– JEDEC Standard two-Byte Signature

(2012h)

– Unique ID code (UID) with 16 bytes read-

only, available upon customer request

– RES Instruction, One-Byte, Signature

(11h), for backward compatibility

Packages

– ECOPACK® (RoHS compliant)

SO8 (MN)

150 mils width

QFN8L (MS)

MLP8 6 x 5 mm

VFQFPN8 (MP)

(MLP8 6 x 5 mm)

October 2008

Rev 12

1/55

www.Numonyx.com

Contents

M25P20

Contents

Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Data Output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data Input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

4.2

4.3

4.4

4.5

4.6

4.7

Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Polling During a Write, Program or Erase Cycle . . . . . . . . . . . . . . . . . . . .11

Active Power, Standby Power and Deep Power-Down Modes . . . . . . . . .11

Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Hold Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6.1

6.2

6.3

6.4

Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6.4.1

6.4.2

6.4.3

6.4.4

WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

6.5

2/55

Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

List of tables

M25P20

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Protected Area Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read Identification (RDID) data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Status Register Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Power-Up Timing and VWI Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Data Retention and Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

DC Characteristics (Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

DC Characteristics (Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Instruction Times, process technology T9HX (Device Grade 6). . . . . . . . . . . . . . . . . . . . . 38

Instruction Times, process technology T7Y, Device Grade 6. . . . . . . . . . . . . . . . . . . . . . . 39

Instruction Times (Device Grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

AC Characteristics (25MHz Operation, Device Grade 6 or 3) . . . . . . . . . . . . . . . . . . . . . . 41

AC Characteristics (40MHz Operation, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . 42

AC Characteristics (50MHz Operation, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . 43

AC characteristics, grade 6 (T9HX technology), 75 MHz operation, VCC min = 2.7 V . . . 44

SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

QFN8L (MLP8) 8-lead dual flat package no lead, 6 x 5 mm package mechanical data. . . 49

VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,

6x5mm, Package Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4/55

M25P20

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

Figure 28.

Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

SO and MLP8 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Bus Master and memory devices on the SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Hold Condition Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write Enable (WREN) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write Disable (WRDI) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read Identification (RDID) Instruction Sequence and Data-Out Sequence . . . . . . . . . . . . 20

Read Status Register (RDSR) Instruction Sequence and Data-Out Sequence . . . . . . . . . 21

Write Status Register (WRSR) Instruction Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 24

Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence

and Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Page Program (PP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Sector Erase (SE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Bulk Erase (BE) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Deep Power-down (DP) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Release from Deep Power-down and Read Electronic Signature (RES) Instruction

Sequence and Data-Out Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Release from Deep Power-down (RES) Instruction Sequence . . . . . . . . . . . . . . . . . . . . . 32

Power-up Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Serial Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Write Protect Setup and Hold Timing during WRSR when SRWD=1. . . . . . . . . . . . . . . . . 46

Hold Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline . . . . . . 48

QFN8L (MLP8) 8-lead, dual flat package no lead, 6 × 5 mm, package outline . . . . . . . . . 49

VFQFPN8 (MLP8) 8-lead Very thin Fine Pitch Dual Flat Package No lead,

6x5mm, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

5/55

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