7M1014S15G datasheet, PDF - EEWORLD Datasheet

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7M1014S15G: Description-0, Tube; Categorystorage storage; File Size334KB，8 Pages; ManufacturerIDT (Integrated Device Technology)

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7M1014S15G Overview

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7M1014S15G Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Maker	IDT (Integrated Device Technology)
package instruction	CERAMIC, PGA-142
Contacts	0
Manufacturer packaging code	GU142
Reach Compliance Code	not_compliant
Maximum access time	15 ns
Other features	SEATED HT-CALCULATED
I/O type	COMMON
JESD-30 code	S-CPGA-P142
JESD-609 code	e0
length	34.036 mm
memory density	147456 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Humidity sensitivity level	1
Number of functions	1
Number of ports	2
Number of terminals	142
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4KX36
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA142,13X13
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	6.223 mm
Maximum slew rate	1.04 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	34.036 mm

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7M1014S15G Related Products

	7M1014S15G	7M1014S20G	7M1014S25GB	7M1014S30GB
Description	-0, Tube	-0, Tube	-0, Tube	-0, Tube
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
package instruction	CERAMIC, PGA-142	CERAMIC, PGA-142	PGA, PGA142,13X13	PGA, PGA142,13X13
Manufacturer packaging code	GU142	GU142	GU142	GU142
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	15 ns	20 ns	25 ns	30 ns
Other features	SEATED HT-CALCULATED	SEATED HT-CALCULATED	SEATED HT-CALCULATED	SEATED HT-CALCULATED
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CPGA-P142	S-CPGA-P142	S-CPGA-P142	S-CPGA-P142
JESD-609 code	e0	e0	e0	e0
length	34.036 mm	34.036 mm	34.036 mm	34.036 mm
memory density	147456 bit	147456 bit	147456 bit	147456 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	36	36	36	36
Humidity sensitivity level	1	1	1	1
Number of functions	1	1	1	1
Number of ports	2	2	2	2
Number of terminals	142	142	142	142
word count	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C	125 °C
organize	4KX36	4KX36	4KX36	4KX36
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA
Encapsulate equivalent code	PGA142,13X13	PGA142,13X13	PGA142,13X13	PGA142,13X13
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	6.223 mm	6.223 mm	6.223 mm	6.223 mm
Maximum slew rate	1.04 mA	1.04 mA	1.04 mA	1.04 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	34.036 mm	34.036 mm	34.036 mm	34.036 mm

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