SRAM Module, 64KX16, 70ns, CMOS,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-XSMA-T40 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 40 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| Encapsulate equivalent code | SIP40,.1 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.08 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.425 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| EDI8F1664C70PSC | EDI8F1664C100PSC | |
|---|---|---|
| Description | SRAM Module, 64KX16, 70ns, CMOS, | SRAM Module, 64KX16, 100ns, CMOS, |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 70 ns | 100 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-XSMA-T40 | R-XSMA-T40 |
| JESD-609 code | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE |
| memory width | 16 | 16 |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 40 | 40 |
| word count | 65536 words | 65536 words |
| character code | 64000 | 64000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 64KX16 | 64KX16 |
| Output characteristics | 3-STATE | 3-STATE |
| Exportable | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| Encapsulate equivalent code | SIP40,.1 | SIP40,.1 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.08 A | 0.08 A |
| Minimum standby current | 4.5 V | 4.5 V |
| Maximum slew rate | 0.425 mA | 0.425 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
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