WF1M32C-100H2C datasheet, PDF - EEWORLD Datasheet

WF1M32C-100H2C: DescriptionFlash Module, 4MX8, 100ns, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size664KB，19 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WF1M32C-100H2C Overview

Flash Module, 4MX8, 100ns, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Maker	White Electronic Designs Corporation
package instruction	1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	100 ns
Other features	CONFIGURABLE AS 1M X 32
Spare memory width	16
JESD-30 code	S-CPGA-P66
length	35.2 mm
memory density	33554432 bit
Memory IC Type	FLASH MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Programming voltage	12 V
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
type	NOR TYPE
width	35.2 mm

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