Flash Card, 8GX8, 250ns, CARD-50
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microsemi |
| Parts packaging code | CARD |
| package instruction | , |
| Contacts | 50 |
| Reach Compliance Code | compliant |
| Maximum access time | 250 ns |
| Other features | IT ALSO OPERATES WITH 4.5V TO 5.5V SUPPLY |
| JESD-30 code | R-XXMA-X50 |
| memory density | 68719476736 bit |
| Memory IC Type | FLASH CARD |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 50 |
| word count | 8589934592 words |
| character code | 8000000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8GX8 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | UNSPECIFIED |
| Terminal location | UNSPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| type | SLC NAND TYPE |
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