FTS8L32512V20AC datasheet, PDF

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FTS8L32512V20AC: DescriptionSRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68; Categorystorage storage; File Size304KB，9 Pages; ManufacturerForce Technologies Ltd.

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FTS8L32512V20AC Overview

SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68

FTS8L32512V20AC Parametric

Parameter Name	Attribute value
Maker	Force Technologies Ltd.
Parts packaging code	LCC
package instruction	QCCJ,
Contacts	68
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	12 ns
JESD-30 code	S-PQCC-J68
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

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Description	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68	SRAM Module, 512KX32, 12ns, CMOS, PQCC68, 0.990 X 0.990 INCH, PLASTIC, MO-47AE, LCC-68
Parts packaging code	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC
package instruction	QCCJ,	QCCJ,	QCCJ,	QCCJ,	QCCJ,	QCCJ,	QCCJ,	QCCJ,	QCCJ,
Contacts	68	68	68	68	68	68	68	68	68
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns	12 ns
JESD-30 code	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68	S-PQCC-J68
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	68	68	68	68	68	68	68	68	68
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C
organize	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm	4.572 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maker	Force Technologies Ltd.	Force Technologies Ltd.	-	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.	Force Technologies Ltd.

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