SPECIALTY INTERFACE CIRCUIT, PQFP80, LEAD FREE, MS-026BEC, LQFP-80
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | QFP |
package instruction | LQFP, |
Contacts | 80 |
Reach Compliance Code | unknown |
Interface integrated circuit type | INTERFACE CIRCUIT |
JESD-30 code | S-PQFP-G80 |
JESD-609 code | e3 |
length | 14 mm |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 80 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | COMMERCIAL |
Maximum seat height | 1.6 mm |
Maximum supply voltage | 1.9 V |
Minimum supply voltage | 1.7 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 14 mm |
AD9980KSTZ-80 | AD9980KSTZ-95 | |
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Description | SPECIALTY INTERFACE CIRCUIT, PQFP80, LEAD FREE, MS-026BEC, LQFP-80 | SPECIALTY INTERFACE CIRCUIT, PQFP80, LEAD FREE, MS-026BEC, LQFP-80 |
Is it lead-free? | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to |
Maker | Rochester Electronics | Rochester Electronics |
Parts packaging code | QFP | QFP |
package instruction | LQFP, | LQFP, |
Contacts | 80 | 80 |
Reach Compliance Code | unknown | unknown |
Interface integrated circuit type | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
JESD-30 code | S-PQFP-G80 | S-PQFP-G80 |
JESD-609 code | e3 | e3 |
length | 14 mm | 14 mm |
Humidity sensitivity level | 3 | 3 |
Number of functions | 1 | 1 |
Number of terminals | 80 | 80 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP |
Package shape | SQUARE | SQUARE |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 260 | 260 |
Certification status | COMMERCIAL | COMMERCIAL |
Maximum seat height | 1.6 mm | 1.6 mm |
Maximum supply voltage | 1.9 V | 1.9 V |
Minimum supply voltage | 1.7 V | 1.7 V |
Nominal supply voltage | 1.8 V | 1.8 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | MATTE TIN | MATTE TIN |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD |
Maximum time at peak reflow temperature | 40 | 40 |
width | 14 mm | 14 mm |