Flash Module, 2MX16, 150ns, CDFP44, CERAMIC, DFP-44
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Parts packaging code | DFP |
package instruction | GDFP, |
Contacts | 44 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 150 ns |
Other features | USER CONFIGURABLE AS 2 X 2M X 8 |
Spare memory width | 8 |
JESD-30 code | R-CDFP-F44 |
JESD-609 code | e0 |
length | 28.45 mm |
memory density | 33554432 bit |
Memory IC Type | FLASH MODULE |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX16 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | GDFP |
Package shape | RECTANGULAR |
Package form | FLATPACK, GUARD RING |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.18 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 12.95 mm |