Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, TSOP1-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | TSOP |
package instruction | TSOP1-28 |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 15 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G28 |
JESD-609 code | e0 |
length | 11.8 mm |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Encapsulate equivalent code | TSSOP28,.53,22 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.002 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.145 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.55 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |
IS61C256AH-15T | IS61C256AH-12T | IS61C256AH-12NI | IS61C256AH-12N | IS61C256AH-15JI | IS61C256AH-10T | IS61C256AH-20JI | IS61C256AH-20N | IS61C256AH-15NI | |
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Description | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, TSOP1-28 | 32KX8 STANDARD SRAM, 12ns, PDSO28, TSOP1-28 | Standard SRAM, 32KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, TSOP1-28 | Standard SRAM, 32KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 | Standard SRAM, 32KX8, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | TSOP | TSOP | DIP | DIP | SOJ | TSOP | SOJ | DIP | DIP |
package instruction | TSOP1-28 | TSOP1-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, SOJ-28 | TSOP1-28 | 0.300 INCH, PLASTIC, SOJ-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 |
Contacts | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compliant | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | 3A991 | EAR99 | 3A991 | EAR99 | EAR99 |
Maximum access time | 15 ns | 12 ns | 12 ns | 12 ns | 15 ns | 10 ns | 20 ns | 20 ns | 15 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-J28 | R-PDIP-T28 | R-PDIP-T28 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 11.8 mm | 11.8 mm | 35.306 mm | 35.306 mm | 18.161 mm | 11.8 mm | 18.161 mm | 35.306 mm | 35.306 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSOP1 | TSOP1 | DIP | DIP | SOJ | TSOP1 | SOJ | DIP | DIP |
Encapsulate equivalent code | TSSOP28,.53,22 | TSSOP28,.53,22 | DIP28,.3 | DIP28,.3 | SOJ28,.34 | TSSOP28,.53,22 | SOJ28,.34 | DIP28,.3 | DIP28,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm | 4.572 mm | 4.572 mm | 3.556 mm | 1.2 mm | 3.556 mm | 4.572 mm | 4.572 mm |
Maximum standby current | 0.002 A | 0.002 A | 0.01 A | 0.002 A | 0.01 A | 0.005 A | 0.01 A | 0.002 A | 0.01 A |
Minimum standby current | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.145 mA | 0.155 mA | 0.17 mA | 0.135 mA | 0.155 mA | 0.165 mA | 0.145 mA | 0.12 mA | 0.16 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | NO | NO | YES | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | J BEND | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 0.55 mm | 0.55 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.55 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8 mm | 8 mm | 7.62 mm | 7.62 mm | 7.59 mm | 8 mm | 7.59 mm | 7.62 mm | 7.62 mm |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - | Contains lead |
Maker | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | - | - | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - | - |