HC/UH SERIES, 13-INPUT NAND GATE, CDIP16, CERAMIC, DIP-16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| series | HC/UH |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 1 |
| Number of entries | 13 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/6 V |
| propagation delay (tpd) | 190 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MM74HC133J | MM54HC133J | MM74HC133N | |
|---|---|---|---|
| Description | HC/UH SERIES, 13-INPUT NAND GATE, CDIP16, CERAMIC, DIP-16 | HC/UH SERIES, 13-INPUT NAND GATE, CDIP16, CERAMIC, DIP-16 | HC/UH SERIES, 13-INPUT NAND GATE, PDIP16, PLASTIC, DIP-16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| series | HC/UH | HC/UH | HC/UH |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| length | 19.43 mm | 19.43 mm | 19.305 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 1 | 1 | 1 |
| Number of entries | 13 | 13 | 13 |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 2/6 V | 2/6 V | 2/6 V |
| propagation delay (tpd) | 190 ns | 220 ns | 190 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
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