Microcontroller, 8-Bit, MROM, 80251 CPU, 16MHz, CMOS, PDIP40, PLASTIC, DIP-40
Parameter Name | Attribute value |
Maker | Intel |
Parts packaging code | DIP |
package instruction | DIP, DIP40,.6 |
Contacts | 40 |
Reach Compliance Code | compliant |
Has ADC | NO |
Address bus width | 16 |
bit size | 8 |
CPU series | 80251 |
maximum clock frequency | 16 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | 8 |
JESD-30 code | R-PDIP-T40 |
length | 52.26 mm |
Number of I/O lines | 32 |
Number of terminals | 40 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP40,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 1024 |
rom(word) | 16384 |
ROM programmability | MROM |
Maximum seat height | 5.08 mm |
speed | 16 MHz |
Maximum slew rate | 80 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
P83C251SB-16 | P80C251SB-16 | C87C251SB-16 | C80C251SB-16 | N87C251SB-16 | P87C251SB-16 | C83C251SB-16 | |
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Description | Microcontroller, 8-Bit, MROM, 80251 CPU, 16MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, 80251 CPU, 16MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, UVPROM, 80251 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, 80251 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40 | Microcontroller, 8-Bit, OTPROM, 80251 CPU, 16MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, OTPROM, 80251 CPU, 16MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, 80251 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40 |
Parts packaging code | DIP | DIP | DIP | DIP | LCC | DIP | DIP |
package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 |
Contacts | 40 | 40 | 40 | 40 | 44 | 40 | 40 |
Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | unknown | compliant |
Has ADC | NO | NO | NO | NO | NO | NO | NO |
Address bus width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU series | 80251 | 80251 | 80251 | 80251 | 80251 | 80251 | 80251 |
maximum clock frequency | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
DAC channel | NO | NO | NO | NO | NO | NO | NO |
DMA channel | NO | NO | NO | NO | NO | NO | NO |
External data bus width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 code | R-PDIP-T40 | R-PDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | R-CDIP-T40 |
length | 52.26 mm | 52.26 mm | 50.8 mm | 50.8 mm | 16.5862 mm | 52.26 mm | 50.8 mm |
Number of I/O lines | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of terminals | 40 | 40 | 40 | 40 | 44 | 40 | 40 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
PWM channel | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP | DIP | QCCJ | DIP | DIP |
Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
rom(word) | 16384 | - | 16384 | - | 16384 | 16384 | 16384 |
ROM programmability | MROM | N/A | UVPROM | N/A | OTPROM | OTPROM | MROM |
Maximum seat height | 5.08 mm | 5.08 mm | 5.51 mm | 5.51 mm | 4.57 mm | 5.08 mm | 5.51 mm |
speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
Maximum slew rate | 80 mA | 80 mA | 80 mA | 80 mA | 80 mA | 80 mA | 80 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.5862 mm | 15.24 mm | 15.24 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Maker | Intel | - | Intel | Intel | Intel | Intel | Intel |