KMPC860DEZQ50D4 datasheet, PDF

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KMPC860DEZQ50D4: Description32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，81 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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KMPC860DEZQ50D4 Overview

32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

KMPC860DEZQ50D4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Contacts	357
Reach Compliance Code	not_compliant
ECCN code	5A991
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B357
length	25 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	357
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA357,19X19,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.52 mm
speed	50 MHz
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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Freescale Semiconductor

Technical Data

MPC860EC

Rev. 8, 08/2007

MPC860 PowerQUICC™ Family

Hardware Specifications

This hardware specification contains detailed information on

power considerations, DC/AC electrical characteristics, and

AC timing specifications for the MPC860 family.

To locate published errata or updates for this document, refer

to the MPC860 product summary page on our website listed

on the back cover of this document or, contact your local

Freescale sales office.

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Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 7

Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 8

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Thermal Calculation and Measurement . . . . . . . . . . 12

Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 15

IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 41

CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 43

UTOPIA AC Electrical Specifications . . . . . . . . . . . 65

FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67

Mechanical Data and Ordering Information . . . . . . . 70

Document Revision History . . . . . . . . . . . . . . . . . . . 76

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Description	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	32-BIT, 50 MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	BGA, BGA357,19X19,50	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	BGA, BGA357,19X19,50	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	BGA, BGA357,19X19,50	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Contacts	357	357	357	357	357	357	357	357	357
Reach Compliance Code	not_compliant	compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	compliant
ECCN code	5A991	3A001.A.3	5A991	5A991	5A991	5A991	5A991	5A991	3A001.A.3
Address bus width	32	32	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
External data bus width	32	32	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357	S-PBGA-B357
length	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	357	357	357	357	357	357	357	357	357
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50	BGA357,19X19,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	NOT SPECIFIED	225	225	225	225	225	225	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm	2.52 mm
speed	50 MHz	66 MHz	50 MHz	66 MHz	50 MHz	66 MHz	66 MHz	50 MHz	50 MHz
Maximum supply voltage	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Humidity sensitivity level	3	-	3	3	3	3	3	3	-

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