QUAD LINE DRIVER, PBGA64, 0.80 MM PITCH, FBGA-64
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | LFBGA, BGA64,8X8,32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Differential output | YES |
Number of drives | 4 |
Input properties | STANDARD |
Interface integrated circuit type | LINE DRIVER |
Interface standards | EIA-644; TIA-644 |
JESD-30 code | S-PBGA-B64 |
JESD-609 code | e0 |
length | 8 mm |
Number of functions | 4 |
Number of terminals | 64 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA64,8X8,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum receive delay | |
Maximum seat height | 1.5 mm |
Maximum slew rate | 55 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |
DS90C383SLCX | |
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Description | QUAD LINE DRIVER, PBGA64, 0.80 MM PITCH, FBGA-64 |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | LFBGA, BGA64,8X8,32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Differential output | YES |
Number of drives | 4 |
Input properties | STANDARD |
Interface integrated circuit type | LINE DRIVER |
Interface standards | EIA-644; TIA-644 |
JESD-30 code | S-PBGA-B64 |
JESD-609 code | e0 |
length | 8 mm |
Number of functions | 4 |
Number of terminals | 64 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA64,8X8,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.5 mm |
Maximum slew rate | 55 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8 mm |