256KX16 UVPROM, 200ns, CQCC44, WINDOWED, CERAMIC, LCC-44
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | STMicroelectronics |
Parts packaging code | LCC |
package instruction | WINDOWED, CERAMIC, LCC-44 |
Contacts | 44 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 200 ns |
I/O type | COMMON |
JESD-30 code | S-CQCC-J44 |
JESD-609 code | e3 |
length | 16.51 mm |
memory density | 4194304 bit |
Memory IC Type | UVPROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX16 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC44,.7SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.83 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.07 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 16.51 mm |