Flash, 4MX16, 70ns, PBGA88, 8 X 11 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, FBGA-88
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | 8 X 11 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, FBGA-88 |
| Contacts | 88 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 70 ns |
| Other features | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
| startup block | BOTTOM |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | R-PBGA-B88 |
| length | 11 mm |
| memory density | 67108864 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of departments/size | 8,127 |
| Number of terminals | 88 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA88,8X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| page size | 8 words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 1.8 V |
| Programming voltage | 1.8 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Department size | 4K,32K |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 1.95 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | YES |
| type | NOR TYPE |
| width | 8 mm |
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