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935285222118

Description
20.6W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size246KB,42 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

935285222118 Overview

20.6W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32

935285222118 Parametric

Parameter NameAttribute value
MakerNXP
package instruction6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32
Reach Compliance Codeunknown
ECCN codeEAR99
Nominal bandwidth20 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
Gain36 dB
harmonic distortion10%
JESD-30 codeR-PDSO-G32
length11 mm
Number of channels2
Number of functions1
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power20.6 W
Package body materialPLASTIC/EPOXY
encapsulated codeHTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)5 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width6.1 mm
TDA8933B
Class D audio amplifier
Rev. 01 — 23 October 2008
Preliminary data sheet
1. General description
The TDA8933B is a high-efficiency class D amplifier with low power dissipation.
The continuous time output power is 2
×
10 W in a stereo half-bridge application
(R
L
= 8
Ω)
or 1
×
20 W in a mono full-bridge application (R
L
=16
Ω).
Due to the low power
dissipation the device can be used without any external heat sink when playing music.
Due to the implementation of Thermal Foldback (TF) the device remains operating with
considerable music output power without the need for an external heat sink, even for high
supply voltages and/or lower load impedances.
The device has two full differential inputs driving two independent outputs. It can be used
in a mono full-bridge configuration (Bridge-Tied Load (BTL)) or as stereo half-bridge
configuration (Single-Ended (SE)).
2. Features
Operating voltage from 10 V to 36 V asymmetrical or
±5
V to
±18
V symmetrical
Mono bridge-tied load (full-bridge) or stereo single-ended (half-bridge) application
Application without heat sink using thermally enhanced small outline package
High efficiency and low-power dissipation
Thermal foldback to avoid audio holes
Current limiting to avoid audio holes
Full short circuit proof across load and to supply lines (using advanced current
protection)
I
Internal or external oscillator (master-slave setting) that can be switched
I
No pop noise
I
Full differential inputs
I
I
I
I
I
I
I
3. Applications
I
I
I
I
I
I
Flat-panel television sets
Flat-panel monitor sets
Multimedia systems
Wireless speakers
Mini/micro systems
Home sound sets

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935285222118 TDA8933BTW/N2,512 TDA8933BTW/N2,518 TDA8933BTW/N2,112 TDA8933BTW/N2,118
Description 20.6W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO32, 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32 IC AMP AUDIO 20.6W STER 32TSSOP IC AMP AUDIO 20.6W STER 32TSSOP IC AMP AUDIO CLASS D 32HTSSOP IC AMP AUDIO CLASS D 32HTSSOP
package instruction 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32 TSSOP, TSSOP32,.3 TSSOP, 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32 6.10 MM, 0.65 MM PITCH, PLASTIC, SOT-249-1, HTSSOP-32
Reach Compliance Code unknown unknown unknown unknown unknown
Nominal bandwidth 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
Gain 36 dB 36 dB 36 dB 36 dB 36 dB
harmonic distortion 10% 10% 10% 10% 10%
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
length 11 mm 11 mm 11 mm 11 mm 11 mm
Number of channels 2 2 2 2 2
Number of functions 1 1 1 1 1
Number of terminals 32 32 32 32 32
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Nominal output power 20.6 W 20.6 W 20.6 W 20.6 W 20.6 W
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HTSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Maximum seat height 1.1 mm 1.1 mm 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 18 V 18 V 18 V 18 V 18 V
Minimum supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
width 6.1 mm 6.1 mm 6.1 mm 6.1 mm 6.1 mm
Maker NXP - NXP NXP NXP
ECCN code EAR99 EAR99 EAR99 - -
Brand Name - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Parts packaging code - TSSOP TSSOP TSSOP TSSOP
Contacts - 32 32 32 32
Manufacturer packaging code - SOT549-1 SOT549-1 SOT549-1 SOT549-1
Encapsulate equivalent code - TSSOP32,.3 - TSSOP32,.3 TSSOP32,.3
power supply - 25 V - 25 V 25 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate - 50 mA - 50 mA 50 mA
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