Dual-Port SRAM, 256KX72, 3.3ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | BGA |
package instruction | 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484 |
Contacts | 484 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 3.3 ns |
JESD-30 code | S-PBGA-B484 |
JESD-609 code | e0 |
length | 23 mm |
memory density | 18874368 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 484 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX72 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Certification status | Not Qualified |
Maximum seat height | 2.16 mm |
Maximum supply voltage (Vsup) | 1.58 V |
Minimum supply voltage (Vsup) | 1.42 V |
Nominal supply voltage (Vsup) | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |