M470L2923BN0-LB0 datasheet, PDF

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M470L2923BN0-LB0: DescriptionDDR DRAM Module, 128MX64, 0.75ns, CMOS, SODIMM-200; Categorystorage storage; File Size285KB，20 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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M470L2923BN0-LB0 Overview

DDR DRAM Module, 128MX64, 0.75ns, CMOS, SODIMM-200

M470L2923BN0-LB0 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	SODIMM
package instruction	DIMM, DIMM200,24
Contacts	200
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	0.75 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-XZMA-N200
JESD-609 code	e0
memory density	8589934592 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	200
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM200,24
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.08 A
Maximum slew rate	3.12 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	0.6 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

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256MB, 512MB, 1GB Unbuffered SODIMM

DDR SDRAM

DDR SDRAM Unbuffered Module

184pin Unbuffered Module based on 512Mb B-die

66 TSOP-II & 54 sTSOP-II

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL

INFORMATION IN THIS DOCUMENT IS PROVIDED

ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar

applications where Product failure could result in loss of life or personal or physical harm, or any military or

defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

Rev. 1.5 June 2005

256MB, 512MB, 1GB Unbuffered SODIMM

Table of Contents

DDR SDRAM

1.0 Ordering Information................................................................................................................... 4

2.0 Operating Frequencies................................................................................................................ 4

3.0 Feature.......................................................................................................................................... 4

4.0 Pin Configuration (Front side/back side) ................................................................................. 5

5.0 Pin Description ............................................................................................................................ 5

6.0 Functional Block Diagram .......................................................................................................... 6

6.1 256MB, 32M x 64 Non ECC Module (M470L3324BT(U)0)

.................................................................... 6

6.2 512MB, 64M x 64 Non ECC Module (M470L6524BT(U)0) ..................................................................................

6.3 1GB, 128M x 64 Non ECC Module (M470L2923BN(V)0)

...................................................................... 8

7.0 Absolute Maximum Ratings........................................................................................................ 9

8.0 DC Operating Conditions............................................................................................................ 9

9.0 DDR SDRAM IDD spec table ..................................................................................................... 10

9.1 M470L3324BT(U)0 [ (32M x 16) * 4, 256MB Non ECC Module ]

.............................................................................

9.2 M470L6524BT(U)0 [ (32M x 16) * 8, 512MB Non ECC Module ]

.............................................................................

9.3 M470L2923BN(V)0 [ (64M x 8) * 16, 1GB Non ECC Module ]

.................................................................................

10.0 AC Operating Conditions........................................................................................................ 12

11.0 Input/Output Capacitance ....................................................................................................... 12

12.0 AC Timming Parameters & Specifications ............................................................................ 13

13.0 System Characteristics for DDR SDRAM .............................................................................. 14

14.0 Component Notes.................................................................................................................... 15

15.0 System Notes ........................................................................................................................... 16

16.0 Command Truth Table............................................................................................................. 17

17.0 Physical Dimensions............................................................................................................... 18

17.1 32Mx64 (M470L3324BT(U)0)

..................................................................................................... 18

17.2 64Mx64 (M470L6524BT(U)0)

..................................................................................................... 19

17.3 128Mx64 (M470L2923BN(V)0)

................................................................................................... 20

Rev. 1.5 June 2005

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