IC,MICROPROCESSOR,32-BIT,CMOS,BGA,255PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| Parts packaging code | BGA |
| package instruction | 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| Contacts | 255 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991 |
| Other features | ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
| Address bus width | 32 |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 100 MHz |
| External data bus width | 64 |
| Format | FLOATING POINT |
| Integrated cache | YES |
| JESD-30 code | S-PBGA-B255 |
| JESD-609 code | e0 |
| length | 21 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of terminals | 255 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA255,16X16,50 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2,2.5/3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.8 mm |
| speed | 300 MHz |
| Maximum supply voltage | 2.1 V |
| Minimum supply voltage | 1.8 V |
| Nominal supply voltage | 2 V |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 21 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
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