WF2M32-XXX5
2Mx32 5V NOR FLASH MODULE
FEATURES
Access Time of 90, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP
(Package 401).
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
(Package 510) 3.56mm (0.140") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 3)
Sector Architecture
• 32 equal size sectors of 64KBytes per each 2Mx8 chip
• Any combination of sectors can be erased. Also supports
full chip erase.
Minimum 100,000 Write/Erase Cycles Minimum
Organized as 2Mx32
Commercial, Industrial, and Military Temperature Ranges
5 Volt Read and Write
Low Power CMOS
Data# Polling and Toggle Bit feature for detection of
program or erase cycle completion.
Supports reading or programming data to a sector not being
erased.
RESET# pin resets internal state machine to the read
mode.
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation, Separate Power and Ground Planes to
improve noise immunity
* This product is subject to change without notice.
Note: For programming information and waveforms refer to Flash Programming 16M5 Application
Note AN0038. RESET# and RY/BY# function and timings don't apply to this device.
FIGURE 1 – PIN CONFIGURATION FOR WF2M32-XHX5
Top View
1
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
11
22
12
WE2#
CS2#
GND
I/O11
A10
A9
A15
V
CC
CS1#
A19
I/O3
33
23
I/O15
I/O14
I/O13
I/O12
OE#
A17
WE1#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
A20
A13
A8
I/O16
I/O17
I/O18
44
34
V
CC
CS4#
WE4#
I/O27
A4
A5
A6
WE3#
CS3#
GND
I/O19
55
45
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
66
I/O0-7
I/O8-15
I/O16-23
I/O24-31
WE1# CS1#
OE#
A0-20
2M x 8
2M x 8
2M x 8
2M x 8
WE2# CS2#
WE3# CS3#
WE4# CS4#
Pin Description
56
I/O0-31
A0-20
WE1-4#
CS1-4#
OE#
V
CC
GND
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Block Diagram
8
8
8
8
RESET# internally tied to V
CC
in the HIP package for this pin configuration. See
Alternate Pin Configuration with RESET# tied to pin 12 for system control of reset
(FIGURE 10, page 11).
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 11
© 2014 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
WF2M32-XXX5
FIGURE 2 – PIN CONFIGURATION FOR WF2M32-XG2UX5
Top View
I/O0-31
A0-20
WE1-4#
CS1-4#
OE#
V
CC
GND
RESET#
RESET#
A0
A1
A2
A3
A4
A5
CS3#
GND
CS4#
WE1#
A6
A7
A8
A9
A10
V
CC
Pin Description
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Reset
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
Block Diagram
WE1# CS1#
RESET#
OE#
A
0-20
2M x 8
2M x 8
2M x 8
2M x 8
WE2# CS2#
WE3# CS3#
WE4# CS4#
V
CC
A11
A12
A13
A14
A15
A16
CS1#
OE#
CS2#
A17
WE2#
WE3#
WE4#
A18
A19
A20
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
The WEDC 68 lead G2U CQFP
fi
lls the same
fi
t and function as the JEDEC 68 lead CQFJ
or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form.
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 11
© 2014 Microsemi Corporation. All rights reserved.
2
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
WF2M32-XXX5
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on Any Pin Relative to V
SS
Storage Temperature
Endurance – Write/Erase Cycles
Data Retention
Symbol
V
T
T
stg
Ratings
-2.0 to +7.0
-65 to +150
100,000 min
20
Unit
V
°C
cycles
years
Parameter
OE# capacitance
WE1-4# capacitance
HIP (PGA)
HIP (Alternate pinout)
CQFP G4T
CQFP G2U
G2U (Alternate pinout)
CS1-4# capacitance
Data I/O capacitance
Address input capacitance
CAPACITANCE
T
A
= +25°C, f = 1.0MHz
Symbol
COE
CWE
CWE
CWE
CWE
CWE
CCS
CI/O
CAD
Max
50
20
50
50
20
50
20
20
50
Unit
pF
pF
pF
pF
pF
pF
pF
pF
pF
NOTES:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, inputs may
overshoot V
SS
to –2.0 V for periods of up to 20 ns. See . Maximum DC voltage on output and
I/O pins is V
CC
+ 0.5 V. During voltage transitions, outputs may overshoot to V
CC
+ 2.0 V for
periods up to 20 ns. See .
2. Minimum DC input voltage on A9, OE#, RESET# pins is –0.5V. During voltage transitions, A9,
OE#, RESET# pins may overshoot V
SS
to –2.0 V for periods of up to 20 ns. See Maximum DC
input voltage on A9, OE#, and RESET# is 12.5 V which may overshoot to 13.5 V for periods up
to 20 ns.
Stresses greater than those listed in this section may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure of the device to
absolute maximum rating conditions for extended periods may affect device reliability.
This parameter is guaranteed by design but not tested.
RECOMMENDED DC OPERATING CONDITIONS
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Operating Temperature (Mil.)
Operating Temperature (Ind.)
Operating Temperature (Com.)
Symbol
V
CC
V
SS
V
IH
V
IL
T
A
T
A
T
A
Min
4.5
0
2.0
-0.5
-55
-40
0
Typ
5.0
0
-
-
-
-
-
Max
5.5
0
V
CC
+ 0.5
+0.8
+125
+85
+70
Unit
V
V
V
V
°C
°C
°C
DC CHARACTERISTICS – CMOS COMPATIBLE
Parameter
Input Leakage Current
Output Leakage Current
V
CC
Active Current for Read (1)
V
CC
Active Current for Program or Erase (2)
V
CC
Standby Current
Output Low Voltage
Output High Voltage
Low V
CC
Lock-Out Voltage
Symbol
I
LI
I
LOx32
I
CC1
I
CC2
I
CC3
V
OL
V
OH
V
LKO
Conditions
V
CC
= V
CC MAX
, V
IN
= GND to V
CC
V
CC
= V
CC MAX
, V
OUT
= GND to V
CC
CS# = V
IL
, OE# = V
IH
, f = 5MHz
CS# = V
IL
, OE# = V
IH
V
CC
= V
CC MAX
, CS# = V
CC
± 0.5V, f = 5MHz, RESET# = V
CC
± 0.5V
I
OL
= 12.0 mA, V
CC
= V
CC MIN
I
OH
= -2.5 mA, V
CC
= V
CC MIN
Min
Max
10
10
160
240
8.0
0.45
4.2
Unit
μA
μA
mA
mA
mA
V
V
V
0.85xV
CC
3.2
NOTES:
1. The I
CC
current is typically less than 8mA/MHz, with OE# at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 11
© 2014 Microsemi Corporation. All rights reserved.
3
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
WF2M32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS - WE# CONTROLLED
Parameter
Write Cycle Time
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase (2)
Read Recovery Time before Write
V
CC
Setup Time
Chip Programming Time
Chip Erase Time (3)
Output Enable Hold Time (4)
RESET# Pulse Width (5)
Symbol
t
AVAV
t
ELWL
t
WLWH
t
AVWL
t
DVWH
t
WHDX
t
WLAX
t
WHWL
t
WHWH1
t
WHWH2
t
GHWL
t
VCS
t
WC
t
CS
t
WP
t
AS
t
DS
t
DH
t
AH
t
WPH
Min
90
0
45
0
45
0
45
20
-90
Max
Min
120
0
50
0
50
0
50
20
-120
Max
Min
150
0
50
0
50
0
50
20
-150
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
μs
sec
μs
μs
sec
sec
ns
ns
300
15
0
50
44
256
t
OEH
t
RP
10
500
10
500
0
50
300
15
0
50
44
256
10
500
300
15
44
256
NOTES:
1. Typical value for t
WHWH1
is 7μs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 32sec.
4. For Toggle and Data Polling.
5. RESET# internally tied to V
CC
for the default pin configuration in the HIP package.
AC CHARACTERISTICS – READ-ONLY OPERATIONS
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
Output Enable to Output Valid
Chip Select High to Output High Z (1)
Output Enable High to Output High Z (1)
Output Hold from Addresses, CS# or OE# Change,
whichever is First
RST Low to Read Mode (1,2)
t
AVAV
t
AVQV
t
ELQV
t
GLQV
t
EHQZ
t
GHQZ
t
AXQX
Symbol
t
RC
t
ACC
t
CE
t
OE
t
DF
t
DF
t
OH
t
Ready
Min
90
-90
Max
90
90
40
20
20
0
20
0
20
Min
120
-120
Max
120
120
50
30
30
0
20
Min
150
-150
Max
150
150
55
35
35
Unit
ns
ns
ns
ns
ns
ns
ns
μs
NOTES:
1. Guaranteed by design, not tested.
2. RESET# internally tied to V
CC
for the default pin configuration in the HIP package.
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 11
© 2014 Microsemi Corporation. All rights reserved.
4
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
WF2M32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED
Parameter
Write Cycle Time
Write Enable Setup Time
Chip Select Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase Time (2)
Read Recovery Time
Chip Programming Time
Chip Erase Time (3)
Output Enable Hold Time (4)
NOTES:
1. Typical value for t
WHWH1
is 7μs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 32sec.
4. For Toggle and Data Polling.
Symbol
t
AVAV
t
WLEL
t
ELEH
t
AVEL
t
DVEH
t
EHDX
t
ELAX
t
EHEL
t
WHWH1
t
WHWH2
t
GHEL
t
WC
t
WS
t
CP
t
AS
t
DS
t
DH
t
AH
t
CPH
Min
90
0
45
0
45
0
45
20
-90
Max
Min
120
0
50
0
50
0
50
20
-120
Max
Min
150
0
50
0
50
0
50
20
-150
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
μs
sec
μs
sec
sec
ns
300
15
0
44
256
t
OEH
10
10
0
300
15
0
44
256
10
300
15
44
256
FIGURE 3 – AC TEST CIRCUIT
Parameter
Input Pulse Levels
I
OL
Current Source
AC TEST CONDITIONS
Typ
V
IL
= 0, V
IH
= 3.0
5
1.5
1.5
Unit
V
ns
V
V
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
D.U.T.
C
eff
= 50 pf
V
Z
≈ 1.5V
(Bipolar Supply)
NOTES:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75 ½.
VZ is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I
OH
Current Source
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2014
Rev. 11
© 2014 Microsemi Corporation. All rights reserved.
5
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
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