S29GL128N11FAI010 datasheet, PDF

S29GL128N11FAI010: DescriptionFlash, 8MX16, 110ns, PBGA64,; Categorystorage storage; File Size1MB，89 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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S29GL128N11FAI010 Overview

Flash, 8MX16, 110ns, PBGA64,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	BGA, BGA64,8X8,40
Reach Compliance Code	unknown
Maximum access time	110 ns
Spare memory width	8
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	S-PBGA-B64
JESD-609 code	e0
memory density	134217728 bit
Memory IC Type	FLASH
memory width	16
Number of departments/size	128
Number of terminals	64
word count	8388608 words
character code	8000000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	SQUARE
Package form	GRID ARRAY
page size	8/16 words
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
ready/busy	YES
Department size	128K
Maximum standby current	0.000005 A
Maximum slew rate	0.09 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE

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