FIFO, 1KX8, 8ns, Synchronous, CMOS, CDIP28, 0.300 INCH, THIN, SIDE BRAZED, DIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 8 ns |
| period time | 12 ns |
| JESD-30 code | R-CDIP-T28 |
| JESD-609 code | e0 |
| length | 35.56 mm |
| memory density | 8192 bit |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX8 |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 20 |
| width | 7.62 mm |
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