Flash, 512KX32, 64ns, DIE-74
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| package instruction | DIE, |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.A |
| Maximum access time | 64 ns |
| Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
| startup block | BOTTOM |
| JESD-30 code | R-XUUC-N74 |
| memory density | 16777216 bit |
| Memory IC Type | FLASH |
| memory width | 32 |
| Number of functions | 1 |
| Number of terminals | 74 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 145 °C |
| Minimum operating temperature | -40 °C |
| organize | 512KX32 |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Parallel/Serial | PARALLEL |
| Programming voltage | 3.3 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| type | NOR TYPE |
| S29CL016J1MDGH037 | S29CD016J1MDGH037 | S29CD016J1MDGH137 | |
|---|---|---|---|
| Description | Flash, 512KX32, 64ns, DIE-74 | Flash, 512KX32, 64ns, DIE-74 | Flash, 512KX32, 64ns, DIE-74 |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| package instruction | DIE, | DIE, | DIE, |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | 3A001.A.2.A | 3A001.A.2.A | 3A001.A.2.A |
| Maximum access time | 64 ns | 64 ns | 64 ns |
| Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
| startup block | BOTTOM | BOTTOM | BOTTOM |
| JESD-30 code | R-XUUC-N74 | R-XUUC-N74 | R-XUUC-N74 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | FLASH | FLASH | FLASH |
| memory width | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 74 | 74 | 74 |
| word count | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 145 °C | 145 °C | 145 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| organize | 512KX32 | 512KX32 | 512KX32 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | DIE | DIE |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Programming voltage | 3.3 V | 2.7 V | 2.7 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V | 2.75 V | 2.75 V |
| Minimum supply voltage (Vsup) | 3 V | 2.5 V | 2.5 V |
| Nominal supply voltage (Vsup) | 3.3 V | 2.6 V | 2.6 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | UPPER | UPPER | UPPER |
| type | NOR TYPE | NOR TYPE | NOR TYPE |
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