KM64B258P-10 datasheet, PDF - EEWORLD Datasheet

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KM64B258P-10: DescriptionCache SRAM, 64KX4, 10ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size153KB，7 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM64B258P-10 Overview

Cache SRAM, 64KX4, 10ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

KM64B258P-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIP
package instruction	DIP, DIP28,.3
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	10 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.35 mm
memory density	262144 bit
Memory IC Type	CACHE SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.32 mm
Maximum standby current	0.008 A
Minimum standby current	4.5 V
Maximum slew rate	0.175 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

KM64B258P-10 Related Products

	KM64B258P-10	KM64B258J-10	KM64B258J-15	KM64B258J-12	KM64B258P-12	KM64B258P-15
Description	Cache SRAM, 64KX4, 10ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Cache SRAM, 64KX4, 10ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Cache SRAM, 64KX4, 15ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Cache SRAM, 64KX4, 12ns, BICMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Cache SRAM, 64KX4, 12ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Cache SRAM, 64KX4, 15ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIP	SOJ	SOJ	SOJ	DIP	DIP
package instruction	DIP, DIP28,.3	SOJ, SOJ28,.34	SOJ, SOJ28,.34	SOJ, SOJ28,.34	DIP, DIP28,.3	DIP, DIP28,.3
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	10 ns	10 ns	15 ns	12 ns	12 ns	15 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T28	R-PDSO-J28	R-PDSO-J28	R-PDSO-J28	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
length	34.35 mm	17.91 mm	17.91 mm	17.91 mm	34.35 mm	34.35 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bi
Memory IC Type	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOJ	SOJ	SOJ	DIP	DIP
Encapsulate equivalent code	DIP28,.3	SOJ28,.34	SOJ28,.34	SOJ28,.34	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	3.56 mm	3.56 mm	3.56 mm	4.32 mm	4.32 mm
Maximum standby current	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.175 mA	0.175 mA	0.13 mA	0.155 mA	0.155 mA	0.13 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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