MASK ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, DIP-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SANYO |
Parts packaging code | DIP |
package instruction | DIP, DIP32,.6 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
length | 41.9 mm |
memory density | 8388608 bit |
Memory IC Type | MASK ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.00003 A |
Maximum slew rate | 0.07 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
LC378100PP-10 | LC378100PM-10 | LC378100PP-20LV | LC378100PM-20LV | |
---|---|---|---|---|
Description | MASK ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, DIP-32 | MASK ROM, 1MX8, 100ns, CMOS, PDSO32, 0.525 INCH, SOP-32 | MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, DIP-32 | MASK ROM, 1MX8, 200ns, CMOS, PDSO32, 0.525 INCH, SOP-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | DIP | SOIC | DIP | SOIC |
package instruction | DIP, DIP32,.6 | SOP, SOP32,.56 | DIP, DIP32,.6 | SOP, SOP32,.56 |
Contacts | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 100 ns | 100 ns | 200 ns | 200 ns |
JESD-30 code | R-PDIP-T32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 41.9 mm | 20.7 mm | 41.9 mm | 20.7 mm |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 |
word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
character code | 1000000 | 1000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP | SOP |
Encapsulate equivalent code | DIP32,.6 | SOP32,.56 | DIP32,.6 | SOP32,.56 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 3 V | 3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 3.1 mm | 5.08 mm | 3.1 mm |
Maximum standby current | 0.00003 A | 0.00003 A | 0.000005 A | 0.000005 A |
Maximum slew rate | 0.07 mA | 0.07 mA | 0.02 mA | 0.02 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 3.3 V | 3.3 V |
surface mount | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 11.2 mm | 15.24 mm | 11.2 mm |
Maker | SANYO | SANYO | - | SANYO |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |