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WED3C755E8MC300BC

Description
350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size311KB,14 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WED3C755E8MC300BC Overview

350MHz, RISC PROCESSOR, CBGA255, 21 X 25 MM, CERAMIC, BGA-255

WED3C755E8MC300BC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeBGA
package instructionBGA,
Contacts255
Reach Compliance Codeunknown
Address bus width
boundary scanYES
maximum clock frequency350 MHz
External data bus width
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeR-CBGA-B255
low power modeYES
Number of terminals255
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.85 mm
speed350 MHz
Maximum supply voltage3.465 V
Minimum supply voltage3.135 V
Nominal supply voltage3.3 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

WED3C755E8MC300BC Preview

White Electronic Designs
RISC Microprocessor Multichip Package
OVERVIEW
The WEDC 755E/SSRAM multichip package is targeted
for high performance, space sensitive, low power systems
and supports the following power management features:
doze, nap, sleep and dynamic power management.
The WED3C755E8MC-XBX multichip package consists
of:
755 RISC processor (E die revision)
Dedicated 1MB SSRAM L2 cache, configured as
128Kx72
21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
Core Frequency/L2 Cache Frequency (300MHz/
150MHz, 350MHz/175MHz)
Maximum 60x Bus frequency = 66MHz
WED3C755E8MC-XBX
The WED3C755E8MC-XBX is offered in Commercial
(0°C to +70°C), industrial (-40°C to +85°C) and military
(-55°C to +125°C) temperature ranges and is well suited
for embedded applications such as missiles, aerospace,
flight computers, fire control systems and rugged critical
systems.
FEATURES
Footprint compatible with WED3C7558M-XBX and
WED3C750A8M-200BX
Footprint compatible with Motorola MPC 745
Replaces WED3C755E8M-XBX and
WED3C755E8MF-XBX
• SSRAM JTAG function no longer available
* This product is subject to change without notice.
FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM
SSRAM
μP
755E
SSRAM
November 2007
Rev. 1
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
FIGURE 2 – BLOCK DIAGRAM
WED3C755E8MC-XBX
November 2007
Rev. 1
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WED3C755E8MC-XBX
FIGURE 3 – BLOCK DIAGRAM, L2 INTERCONNECT
SSRAM 1
L2pin_DATA
L2pin_DATA
L2pin_DATA
L2pin_DATA
L2DP
0-3
L2 CLK_OUT A
L2WE#
L2CE#
DQa
DQb
DQc
DQd
DP0-3
K
SGW
SE1
U1
FT#
SBd#
SBc#
SBb#
SBa#
SW#
ADSP#
ADV#
SE2
L20Vdd
ADSC#
SE3#
LBO#
G#
SA
0-16
ZZ
mP
755
E
A
0-16
SSRAM 2
SA
0-16
U2
FT#
SBd#
SBc#
SBb#
SBa#
SW#
ADSP#
ADV#
SE2
ADSC#
SE3#
LBO#
G#
L2DP
4-7
DP
0-3
ZZ
L2ZZ
L20Vdd
L2CLK_OUT B
L2pin_DATA
L2pin_DATA
L2pin_DATA
L2pin_
DATA
SGW#
SE1#
K
DQa
DQb
DQc
DQd
November 2007
Rev. 1
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
FIGURE 5 – PIN ASSIGNMENTS
WED3C755E8MC-XBX
Ball assignments of the 255 CBGA package as viewed from the top surface.
Side profile of the CBGA package to indicate the direction of the top surface view.
November 2007
Rev. 1
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
PACKAGE PINOUT LISTING
Signal Name
A[0-31]
AACK#
ABB#
AP[0-3]
ARTRY#
AVCC
BG#
BR#
BVSEL (4, 5, 6)
CI#
CKSTP_IN#
CKSTP_OUT#
CLK_OUT#
DBB#
DBG#
DBDIS#
DBWO#
DH[0-31]
DL[0-31]
DP[0-7]
DRTRY#
GBL#
GND
HRESET#
INT#
L1_TSTCLK (1)
L2_TSTCLK (1)
L2AVCC (8)
L2OVCC
L2VSEL (4, 5, 6, 7)
LSSD_MODE# (1)
MCP#
NC (No-connect)
OVCC (2)
PLL_CFG[0-3]
QACK#
QREQ#
RSRV#
SMI#
SRESET#
WED3C755E8MC-XBX
Pin Number
C16, E4, D13, F2, D14, G1, D15, E2, D16, D4, E13, G2, E15, H1, E16, H2, F13, J1, F14,
J2, F15, H3, F16, F4, G13, K1, G15, K2, H16, M1, J15, P1
L2
K4
C1, B4, B3, B2
J4
A10
L1
B6
B1
E1
D8
A6
D7
J14
N1
H15
G4
P14, T16, R15, T15, R13, R12, P11, N11, R11, T12, T11, R10, P9, N9, T10, R9, T9, P8, N8,
R8, T8, N7, R7, T7, P6, N6, R6, T6, R5, N5, T5, T4
K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16, N15, N13, N14, P16, P15, R16,
R14, T14, N10, P13, N12, T13, P3, N3, N4, R3, T1, T2, P4, T3, R4
M2, L3, N2, L4, R1, P2, M4, R2
G16
F1
C5, C12, E3, E6, E8, E9, E11, E14, F5, F7, F10, F12, G6, G8, G9, G11, H5, H7, H10, H12,
J5, J7, J10, J12, K6, K8, K9, K11, L5, L7, L10, L12, M3, M6, M8, M9, M11, M14, P5, P12
A7
B15
D11
D12
L11
E10, E12, M12, G12, G14, K12, K14
B5
B10
C13
A2, A3, A4, A5, B7, B8, C3, C6, C8, D5, D6, H4, J16
C7, E5, G3, G5, K3, K5, P7, P10, E7, M5, M7, M10
A8, B9, A9, D9
D3
J3
D1
A16
B14
Active
High
Low
Low
High
Low
Low
Low
High
Low
Low
Low
Low
Low
Low
Low
High
High
High
Low
Low
Low
Low
High
High
High
Low
Low
High
Low
Low
Low
Low
Low
I/O
I/O
Input
I/O
I/O
I/O
Input
Output
Input
Output
Input
Ouput
Output
I/O
Input
Input
Input
I/O
I/O
I/O
Input
I/O
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Output
Input
Input
I/F Voltage
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
2.0V
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
GND
OV
CC
OV
CC
2.0V
L20V
CC
L20V
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
OV
CC
November 2007
Rev. 1
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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