|
IS45S81600B-7TLA1 |
IS45S81600B-7TA1 |
IS45S16800B-7TA1 |
Description |
Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, PLASTIC, TSOP2-54 |
Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, PLASTIC, TSOP2-54 |
Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, PLASTIC, TSOP2-54 |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
Maker |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Integrated Silicon Solution ( ISSI ) |
Parts packaging code |
TSOP2 |
TSOP2 |
TSOP2 |
package instruction |
TSOP2, TSOP54,.46,32 |
PLASTIC, TSOP2-54 |
PLASTIC, TSOP2-54 |
Contacts |
54 |
54 |
54 |
Reach Compliance Code |
compliant |
unknown |
unknow |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
access mode |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
FOUR BANK PAGE BURST |
Maximum access time |
5.4 ns |
5.4 ns |
5.4 ns |
Other features |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) |
143 MHz |
143 MHz |
143 MHz |
I/O type |
COMMON |
COMMON |
COMMON |
interleaved burst length |
1,2,4,8 |
1,2,4,8 |
1,2,4,8 |
JESD-30 code |
R-PDSO-G54 |
R-PDSO-G54 |
R-PDSO-G54 |
JESD-609 code |
e3 |
e0 |
e0 |
length |
22.22 mm |
22.22 mm |
22.22 mm |
memory density |
134217728 bit |
134217728 bit |
134217728 bi |
Memory IC Type |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
memory width |
8 |
8 |
16 |
Humidity sensitivity level |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
Number of terminals |
54 |
54 |
54 |
word count |
16777216 words |
16777216 words |
8388608 words |
character code |
16000000 |
16000000 |
8000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
organize |
16MX8 |
16MX8 |
8MX16 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSOP2 |
TSOP2 |
TSOP2 |
Encapsulate equivalent code |
TSOP54,.46,32 |
TSOP54,.46,32 |
TSOP54,.46,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
refresh cycle |
4096 |
4096 |
4096 |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
self refresh |
YES |
YES |
YES |
Continuous burst length |
1,2,4,8,FP |
1,2,4,8,FP |
1,2,4,8,FP |
Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
Maximum slew rate |
0.16 mA |
0.16 mA |
0.16 mA |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Matte Tin (Sn) - annealed |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10.16 mm |
10.16 mm |
10.16 mm |