Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, PLASTIC, REVERSE, TSOP1-24/20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | TSOP |
package instruction | TSOP1-R, TSSOP20/24,.63,20 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 60 ns |
Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
I/O type | COMMON |
JESD-30 code | R-PDSO-G20 |
JESD-609 code | e0 |
length | 14.4 mm |
memory density | 4194304 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 20 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX4 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1-R |
Encapsulate equivalent code | TSSOP20/24,.63,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
reverse pinout | YES |
Maximum seat height | 1.2 mm |
self refresh | NO |
Maximum standby current | 0.0002 A |
Maximum slew rate | 0.09 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 6 mm |