MT58LC256K16B3S27BDC3-8.5 datasheet, PDF

MT58LC256K16B3S27BDC3-8.5: DescriptionStandard SRAM, 256KX16, 8.5ns, CMOS; Categorystorage storage; File Size522KB，14 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58LC256K16B3S27BDC3-8.5 Overview

Standard SRAM, 256KX16, 8.5ns, CMOS

Parameter Name	Attribute value
Maker	Micron Technology
package instruction	DIE,
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	8.5 ns
JESD-30 code	R-XUUC-N77
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	77
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	UPPER

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