Flash, 8KX8, ROHS COMPLIANT, WAFER
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IC Microsystems Sdn Bhd |
Parts packaging code | WAFER |
package instruction | ROHS COMPLIANT, WAFER |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 0.4 MHz |
JESD-30 code | X-XUUC-N |
memory density | 65536 bit |
Memory IC Type | FLASH |
memory width | 8 |
Number of functions | 1 |
word count | 8192 words |
character code | 8000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | UNSPECIFIED |
Package form | UNCASED CHIP |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | NOT SPECIFIED |
type | NOR TYPE |
Maximum write cycle time (tWC) | 10 ms |