Flash Module, 512KX8, 200ns,
Parameter Name | Attribute value |
Maker | EDI [Electronic devices inc.] |
Reach Compliance Code | unknown |
Maximum access time | 200 ns |
Other features | CONFIGURABLE AS 128K X 32 |
Spare memory width | 16 |
JESD-30 code | S-XHIP-P66 |
memory density | 4194304 bit |
Memory IC Type | FLASH MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
Package shape | SQUARE |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | PIN/PEG |
Terminal location | HEX |
EDI7M32128C200GM | EDI7M32128C120AGC | EDI7M32128C200AGC | EDI7M32128C150AGC | EDI7M32128C200GB | EDI7M32128C150GM | EDI7M32128C120GB | EDI7M32128C150GB | EDI7M32128C120GM | |
---|---|---|---|---|---|---|---|---|---|
Description | Flash Module, 512KX8, 200ns, | Flash Module, 512KX8, 120ns, | Flash Module, 512KX8, 200ns, | Flash Module, 512KX8, 150ns, | Flash Module, 512KX8, 200ns, | Flash Module, 512KX8, 150ns, | Flash Module, 512KX8, 120ns, | Flash Module, 512KX8, 150ns, | Flash Module, 512KX8, 120ns, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 200 ns | 120 ns | 200 ns | 150 ns | 200 ns | 150 ns | 120 ns | 150 ns | 120 ns |
Other features | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 | CONFIGURABLE AS 128K X 32 |
Spare memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
JESD-30 code | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 | S-XHIP-P66 |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 | 66 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | - | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | HEX | HEX | HEX | HEX | HEX | HEX | HEX | HEX | HEX |
Maker | EDI [Electronic devices inc.] | - | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |